| Support vector regression-based active subspace (SVR-AS) modeling of high-speed links for fast and accurate sensitivity analysis H Ma, EP Li, AC Cangellaris, X Chen IEEE Access 8, 74339-74348, 2020 | 34 | 2020 |
| Comparative study of surrogate modeling methods for signal integrity and microwave circuit applications T Nguyen, B Shi, H Ma, EP Li, X Chen, AC Cangellaris, J Schutt-Aine IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 25 | 2021 |
| Circuit modeling for RRAM-based neuromorphic chip crossbar array with and without write-verify scheme T Tao, H Ma, Q Chen, ZM Gu, H Jin, M Ahmed, S Tan, A Wang, EX Liu, ... IEEE Transactions on Circuits and Systems I: Regular Papers 68 (5), 1906-1916, 2021 | 23 | 2021 |
| Ultrawideband dual-polarized frequency-selective absorber with tunable reflective notch Y Fan, D Li, H Ma, J Xing, Y Gu, LK Ang, EP Li IEEE Transactions on Antennas and Propagation 71 (3), 2855-2860, 2023 | 22 | 2023 |
| PCB PDN prelayout library for top-layer inductance and the equivalent model for decoupling capacitors S Yang, YS Cao, H Ma, J Cho, AE Ruehli, JL Drewniak, E Li IEEE Transactions on Electromagnetic Compatibility 60 (6), 1898-1906, 2017 | 20 | 2017 |
| Deep Learning Inverse Analysis of Higher Order Modes in Monocone TEM Cell D Li, Y Gu, H Ma, Y Li, L Zhang, R Li, R Hao, EP Li IEEE Transactions on Microwave Theory and Techniques 70 (12), 5332-5339, 2022 | 19 | 2022 |
| Angle-insensitive toroidal metasurface for high-efficiency sensing P Qin, E Li, T Li, H Ma, Y Yang, LK Ang, H Chen IEEE Transactions on Microwave Theory and Techniques 69 (3), 1511-1517, 2020 | 15 | 2020 |
| Comparison of machine learning techniques for predictive modeling of high-speed links H Ma, EP Li, AC Cangellaris, X Chen 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 15 | 2019 |
| Machine learning for complex EMI prediction, optimization and localization H Jin, L Zhang, HZ Ma, SC Yang, XL Yang, EP Li 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2017 | 15 | 2017 |
| High-speed link design optimization using machine learning SVR-AS method H Ma, EP Li, AC Cangellaris, X Chen 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 12 | 2020 |
| Deep learning method for prediction of planar radiating sources from near-field intensity data H Ma, EP Li, J Schutt-Aine, AC Cangellaris 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 11 | 2019 |
| EMI radiation prediction and structure optimization of packages by deep learning H Jin, H Ma, MD Butala, EX Liu, EP Li IEEE Access 7, 93772-93780, 2019 | 11 | 2019 |
| An Electromagnetic Perspective of Artificial Intelligence Neuromorphic Chips EP Li, H Ma, M Ahmed, T Tao, Z Gu, M Chen, Q Chen, D Li, W Chen Electromagnetic Science, 2023 | 10 | 2023 |
| A new pre-conditioned STDP rule and its hardware implementation in neuromorphic crossbar array T Tao, D Li, H Ma, Y Li, S Tan, E Liu, J Schutt-Aine, EP Li Neurocomputing 557, 126682, 2023 | 8 | 2023 |
| Failure diagnosis of microstrip antenna array based on convolutional neural network Q Chen, H Ma, EP Li 2019 IEEE Asia-Pacific Microwave Conference (APMC), 90-92, 2019 | 7 | 2019 |
| Spoof surface plasmonic graphene for controlling the transports and emissions of electromagnetic waves P Qin, EP Li, Y Yang, H Ma, B Zheng, F Gao, Z Wang, L Shen, R Hao, ... IEEE Transactions on Microwave Theory and Techniques 67 (1), 50-56, 2018 | 7 | 2018 |
| Modeling and Analysis of Spike Signal Sequence for Memristor Crossbar Array in Neuromorphic Chips T Tao, H Ma, D Li, Y Li, S Tan, EX Liu, J Schutt-Aine, EP Li IEEE Transactions on Circuits and Systems I: Regular Papers, 2023 | 5 | 2023 |
| Efficient EMI Analysis and Self-Shielding Design Method for Pin Map of System-in-Package R Xu, D Li, R Song, H Ma, Z Gu, L Zhang, EP Li IEEE Transactions on Electromagnetic Compatibility, 2023 | 4 | 2023 |
| Modular Neural Network Based Models of High-Speed Link Transceivers Y Zhao, T Nguyen, H Ma, EP Li, A Cangellaris, JE Schutt-Ainé IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 4 | 2023 |
| Prediction of IC Equivalent Magnetic Dipoles Using Deep Convolutional Neural Network H Ma, EP Li 2018 IEEE electrical design of advanced packaging and systems symposium …, 2018 | 4 | 2018 |
Er Ping LIZhejiang University在 zju.edu.cn 的电子邮件经过验证
