| Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems V Verdingovas, MS Jellesen, R Ambat Journal of Electronic Materials 44, 1116-1127, 2015 | 115 | 2015 |
| Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies V Verdingovas, MS Jellesen, R Ambat IEEE Transactions on Device and Materials Reliability 14 (1), 42-51, 2013 | 74 | 2013 |
| Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components V Verdingovas, MS Jellesen, R Ambat Corrosion Engineering, Science and Technology 48 (6), 426-435, 2013 | 63 | 2013 |
| Relative effect of solder flux chemistry on the humidity related failures in electronics V Verdingovas, MS Jellesen, R Ambat Soldering & Surface Mount Technology 27 (4), 146-156, 2015 | 58 | 2015 |
| Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics H Conseil, V Verdingovas, MS Jellesen, R Ambat Journal of Materials Science: Materials in Electronics 27, 23-32, 2016 | 40 | 2016 |
| Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators K Piotrowska, V Verdingovas, R Ambat Journal of Materials Science: Materials in Electronics 29 (20), 17834-17852, 2018 | 35 | 2018 |
| Corrosion in electronics: Overview of failures and countermeasures MS Jellesen, V Verdingovas, H Conseil, K Piotrowska, R Ambat European Corrosion Congress, 2014 | 28 | 2014 |
| Analysis of mode-hopping effect in Fabry–Pérot multiple-quantum well laser diodes via low frequency noise investigation S Pralgauskaitė, V Palenskis, J Matukas, B Šaulys, V Kornijčuk, ... Solid-state electronics 79, 104-110, 2013 | 25 | 2013 |
| Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics H Conseil, MS Jellesen, V Verdingovas, R Ambat European Corrosion Congress: Corrosion Control for a Blue Sky, Paper H, 2013 | 18 | 2013 |
| Analysis of surface insulation resistance related failures in electronics by circuit simulation V Verdingovas, S Joshy, MS Jellesen, R Ambat Circuit World 43 (2), 45-55, 2017 | 17 | 2017 |
| Effect of pulsed voltage on electrochemical migration of tin in electronics V Verdingovas, MS Jellesen, R Ambat Journal of Materials Science: Materials in Electronics 26, 7997-8007, 2015 | 17 | 2015 |
| Effect of iodine on the corrosion of Au–Al wire bonds V Verdingovas, L Müller, MS Jellesen, FB Grumsen, R Ambat Corrosion Science 97, 161-171, 2015 | 17 | 2015 |
| Corrosion in electronics R Ambat, HVC Gudla, V Verdingovas Reference Module in Chemistry, Molecular Sciences and Chemical Engineering, 2017 | 16 | 2017 |
| Impact of hygroscopicity and composition of solder flux residue on the reliability of PCBA under corrosive conditions V Verdingovas, MS Jellesen, R Rizzo, H Conseil, R Ambat European Corrosion Congress: Corrosion Control for a Blue Sky, 2013 | 15 | 2013 |
| Corrosion reliability of lead-free solder systems used in electronics F Li, V Verdingovas, K Dirscherl, B Medgyes, R Ambat 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 67-71, 2018 | 12 | 2018 |
| On the effects of atmospheric particles contamination and humidity on tin corrosion L D’Angelo, V Verdingovas, L Ferrero, E Bolzacchini, R Ambat IEEE Transactions on Device and Materials Reliability 17 (4), 746-757, 2017 | 12 | 2017 |
| Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards V Verdingovas, MS Jellesen, R Ambat Microelectronics Reliability 73, 158-166, 2017 | 11 | 2017 |
| Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys F Li, V Verdingovas, K Dirscherl, G Harsányi, B Medgyes, R Ambat Journal of Materials Science: Materials in Electronics 31, 15308-15321, 2020 | 10 | 2020 |
| Circuit analysis to predict humidity related failures in electronics-Methodology and recommendations S Joshy, V Verdingovas, MS Jellesen, R Ambat Microelectronics Reliability 93, 81-88, 2019 | 8 | 2019 |
| Effect of hygroscopic atmospheric particles deposition on the corrosion reliability of electronics L D'Angelo, V Verdingovas, L Ferrero, E Bolzacchini, R Ambat European Corrosion Congress, EUROCORR 2016 2, 956-965, 2016 | 7 | 2016 |
