| Silicon-based packaging platform for light-emitting diode C Tsou, YS Huang IEEE Transactions on advanced packaging 29 (3), 607-614, 2006 | 91 | 2006 |
| The implementation of a thermal bubble actuated microfluidic chip with microvalve, micropump and micromixer C Huang, C Tsou Sensors and actuators A: Physical 210, 147-156, 2014 | 68 | 2014 |
| Determination of thermal expansion coefficient of thermal oxide C Tsou, YS Huang, HC Li, TH Lai Sens. Mater 17 (11), 2005 | 44 | 2005 |
| A novel self-aligned vertical electrostatic combdrives actuator for scanning micromirrors C Tsou, WT Lin, CC Fan, BCS Chou Journal of Micromechanics and Microengineering 15 (4), 855, 2005 | 38 | 2005 |
| Array-type modularized light-emitting diode structure and a method for packaging the structure CF Tsou, IJ Chen, YC Chao US Patent 7,329,942, 2008 | 32 | 2008 |
| Design and fabrication of acoustic wave actuated microgenerator for portable electronic devices T Lai, C Huang, C Tsou 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 28-33, 2008 | 30 | 2008 |
| Thermoelectric sensor for fingerprint thermal imaging BCS Chou, YW Cheng, CF Tsou, ML Tsai US Patent 7,406,185, 2008 | 26 | 2008 |
| A silicon-based LED packaging substrate with an island structure for phosphor encapsulation shaping Y Chu, C Chen, C Tsou IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2014 | 21 | 2014 |
| Three-dimensional passive micromixer fabricated by two-photon polymerization for microfluidic mixing YJ Liu, PY Chen, JY Yang, C Tsou, YH Lee, PL Baldeck, CL Lin Sensors and Materials 26 (2), 39-44, 2014 | 18 | 2014 |
| Optically driven mobile integrated micro-tools for a lab-on-a-chip YJ Liu, YH Lee, YS Lin, C Tsou, PL Baldeck, CL Lin Actuators 2 (2), 19-26, 2013 | 17 | 2013 |
| A new method for microlens fabrication by a heating encapsulated air process C Tsou, C Lin IEEE photonics technology letters 18 (23), 2490-2492, 2006 | 16 | 2006 |
| Interfaces friction effect of sliding contact on nanoindentation test C Tsou, C Hsu, W Fang Sensors and Actuators A: Physical 117 (2), 309-316, 2005 | 16 | 2005 |
| A novel wafer-level hermetic packaging for MEMS devices C Tsou, H Li, HC Chang IEEE Transactions on advanced packaging 30 (4), 616-621, 2007 | 15 | 2007 |
| Bidirectional and vertical motion actuator and method for manufacturing the same B Chou, CC Fan, WT Lin, ML Tsai, WL Fang, C Tsou US Patent App. 10/656,223, 2004 | 15 | 2004 |
| Novel silicon-based LED packaging module with an integrated photosensing element K Tseng, C Tsou IEEE Photonics technology letters 25 (5), 515-518, 2013 | 14 | 2013 |
| Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter C Hsu, C Tsou, W Fang Journal of Micro/Nanolithography, MEMS and MOEMS 6 (3), 033011-033011-7, 2007 | 14 | 2007 |
| Characterization study of time-and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications CT Kuo, MC Yip, KN Chiang, C Tsou Journal of electronic materials 34, 272-281, 2005 | 14 | 2005 |
| A novel sensing chip with dual-coil inductance for determining raw milk quality W Li, S Liao, C Tsou Sensors and Actuators A: Physical 241, 96-103, 2016 | 13 | 2016 |
| On the out-of-plane deformation of V-shaped micromachined beams CF Tsou, H Yin, W Fang Journal of Micromechanics and Microengineering 11 (2), 153, 2001 | 13 | 2001 |
| The effect of residual stresses on the deformation of semi-circular micromachined beams C Tsou, W Fang Journal of Micromechanics and Microengineering 10 (1), 34, 2000 | 13 | 2000 |
