| Dual junction GaInP/GaAs solar cells grown on metamorphic SiGe/Si substrates with high open circuit voltage MR Lueck, CL Andre, AJ Pitera, ML Lee, EA Fitzgerald, SA Ringel IEEE Electron Device Letters 27 (3), 142-144, 2006 | 180 | 2006 |
| Fabrication of TSV-based silicon interposers D Malta, E Vick, S Goodwin, C Gregory, M Lueck, A Huffman, D Temple 2010 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2010 | 55 | 2010 |
| Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration A Huffman, J Lannon, M Lueck, C Gregory, D Temple Journal of Instrumentation 4 (03), P03006, 2009 | 53 | 2009 |
| Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs D Malta, C Gregory, M Lueck, D Temple, M Krause, F Altmann, M Petzold, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1815-1821, 2011 | 42 | 2011 |
| High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration JD Reed, M Lueck, C Gregory, A Huffman, JM Lannon, D Temple 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 42 | 2010 |
| High density Cu-Cu interconnect bonding for 3-D integration J Lannon, C Gregory, M Lueck, A Huffman, D Temple 2009 59th Electronic Components and Technology Conference, 355-359, 2009 | 37 | 2009 |
| Applying microfabrication to helical vacuum electron devices for THz applications JA Dayton, CL Kory, GT Mearini, D Malta, M Lueck, K Gilchrist 2009 IEEE International Vacuum Electronics Conference, 41-44, 2009 | 36 | 2009 |
| Effects of assembly process parameters on the structure and thermal stability of Sn-capped Cu bump bonds A Huffman, M Lueck, C Bower, D Temple 2007 Proceedings 57th Electronic Components and Technology Conference, 1589-1596, 2007 | 34 | 2007 |
| High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits MR Lueck, JD Reed, CW Gregory, A Huffman, JM Lannon, DS Temple IEEE transactions on electron devices 59 (7), 1941-1947, 2012 | 33 | 2012 |
| Through glass vias (TGV) and aspects of reliability M Lueck, A Huffman, A Shorey 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 672-677, 2015 | 32 | 2015 |
| Microfabrication of diamond-based slow-wave circuits for mm-wave and THz vacuum electronic sources MR Lueck, DM Malta, KH Gilchrist, CL Kory, GT Mearini, JA Dayton Journal of Micromechanics and Microengineering 21 (6), 065022, 2011 | 29 | 2011 |
| 95 GHz helical TWT design CL Kory, JA Dayton, GT Mearini, D Malta, M Lueck, K Gilchrist, B Vancil 2009 IEEE International Vacuum Electronics Conference, 125-126, 2009 | 29 | 2009 |
| High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits Z Feng, MR Lueck, DS Temple, MB Steer IEEE Transactions on Microwave Theory and Techniques 60 (7), 2066-2072, 2012 | 28 | 2012 |
| High density metal–metal interconnect bonding for 3-D integration JM Lannon, C Gregory, M Lueck, JD Reed, CA Huffman, D Temple IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (1 …, 2011 | 27 | 2011 |
| Microfabrication of fine-pitch high aspect ratio Faraday cup arrays in silicon CA Bower, KH Gilchrist, MR Lueck, BR Stoner Sensors and Actuators A: Physical 137 (2), 296-301, 2007 | 26 | 2007 |
| Nanoimprint lithography fabrication of waveguide-integrated optical gratings with inexpensive stamps S Grego, A Huffman, M Lueck, BR Stoner, J Lannon Microelectronic engineering 87 (10), 1846-1851, 2010 | 19 | 2010 |
| Fabrication and testing of the 0.650 THz helical BWO JA Dayton, CL Kory, GT Mearini, D Malta, M Lueck, B Vancil IVEC 2012, 33-34, 2012 | 17 | 2012 |
| Bonding for 3-D integration of heterogeneous technologies and materials D Temple, D Malta, JM Lannon, M Lueck, A Huffman, C Gregory, ... ECS Transactions 16 (8), 3, 2008 | 17 | 2008 |
| A 650 GHz helical BWO JA Dayton, CL Kory, GT Mearini, D Malta, M Lueck, CA Bower 2008 IEEE International Vacuum Electronics Conference, 396-397, 2008 | 14 | 2008 |
| TSV-last, heterogeneous 3D integration of a SiGe BiCMOS beamformer and patch antenna for a W-band phased array radar D Malta, E Vick, M Lueck, A Huffman, S Woodruff, P Ralston, J Hartman, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1457-1464, 2016 | 13 | 2016 |
