| Influence of temperature on microelectronics and system reliability: A physics of failure approach P Lall, MG Pecht, EB Hakim CRC press, 2020 | 322 | 2020 |
| Reliability of the aging lead free solder joint H Ma, JC Suhling, P Lall, MJ Bozack 56th Electronic Components and Technology Conference 2006, 16 pp., 2006 | 232 | 2006 |
| The influence of elevated temperature aging on reliability of lead free solder joints H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack 2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007 | 230 | 2007 |
| Determination of Anand constants for SAC solders using stress-strain or creep data M Motalab, Z Cai, JC Suhling, P Lall 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 200 | 2012 |
| The effects of aging temperature on SAC solder joint material behavior and reliability Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack 2008 58th Electronic Components and Technology Conference, 99-112, 2008 | 188 | 2008 |
| Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006 | 182 | 2006 |
| Reduction of lead free solder aging effects using doped SAC alloys Z Cai, Y Zhang, JC Suhling, P Lall, RW Johnson, MJ Bozack 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 175 | 2010 |
| Model for BGA and CSP reliability in automotive underhood applications P Lall, MN Islam, N Singh, JC Suhling, R Darveaux IEEE Transactions on Components and Packaging Technologies 27 (3), 585-593, 2004 | 173 | 2004 |
| Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling P Lall, S Gupte, P Choudhary, J Suhling IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007 | 162 | 2007 |
| Flexible connector for circuit boards JG Gillette, SG Potter, P Lall US Patent 5,742,484, 1998 | 143 | 1998 |
| Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies P Lall, P Choudhary, S Gupte, J Suhling 56th Electronic Components and Technology Conference 2006, 10 pp., 2006 | 142 | 2006 |
| Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling IEEE Transactions on Components and Packaging Technologies 31 (1), 104-113, 2008 | 137 | 2008 |
| Prognostics and health management of electronic packaging P Lall, MN Islam, MK Rahim, JC Suhling IEEE Transactions on Components and Packaging Technologies 29 (3), 666-677, 2006 | 136 | 2006 |
| Improved predictions of lead free solder joint reliability that include aging effects M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall 2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012 | 134 | 2012 |
| The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders M Mustafa, Z Cai, JC Suhling, P Lall 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 927-939, 2011 | 125 | 2011 |
| Correlation of reliability models including aging effects with thermal cycling reliability data M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall 2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 2013 | 123 | 2013 |
| The effects of SAC alloy composition on aging resistance and reliability Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack 2009 59th Electronic Components and Technology Conference, 370-389, 2009 | 121 | 2009 |
| Statistical pattern recognition and built-in reliability test for feature extraction and health monitoring of electronics under shock loads P Lall, P Choudhary, S Gupte, J Hofmeister IEEE Transactions on Components and Packaging Technologies 32 (3), 600-616, 2009 | 116 | 2009 |
| Characterization of aging effects in lead free solder joints using nanoindentation M Hasnine, M Mustafa, JC Suhling, BC Prorok, MJ Bozack, P Lall 2013 IEEE 63rd Electronic Components and Technology Conference, 166-178, 2013 | 112 | 2013 |
| Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys P Lall, S Shantaram, J Suhling, D Locker 2013 IEEE 63rd Electronic Components and Technology Conference, 1277-1293, 2013 | 105 | 2013 |
