| High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration CC Liu, SM Chen, FW Kuo, HN Chen, EH Yeh, CC Hsieh, LH Huang, ... 2012 International Electron Devices Meeting, 14.1. 1-14.1. 4, 2012 | 135 | 2012 |
| A Bluetooth low-energy transceiver with 3.7-mW all-digital transmitter, 2.75-mW high-IF discrete-time receiver, and TX/RX switchable on-chip matching network FW Kuo, SB Ferreira, HNR Chen, LC Cho, CP Jou, FL Hsueh, I Madadi, ... IEEE Journal of Solid-State Circuits 52 (4), 1144-1162, 2017 | 134 | 2017 |
| A fully integrated Bluetooth low-energy transmitter in 28 nm CMOS with 36% system efficiency at 3 dBm M Babaie, FW Kuo, HNR Chen, LC Cho, CP Jou, FL Hsueh, ... IEEE Journal of Solid-State Circuits 51 (7), 1547-1565, 2016 | 103 | 2016 |
| Antenna cavity structure for integrated patch antenna in integrated fan-out packaging WS Liao, CP Jou, FW Kuo US Patent 9,711,465, 2017 | 86 | 2017 |
| 3D transmission lines for semiconductors YL Lin, HT Yen, FW Kuo, HH Chen, CW Kuo US Patent 8,912,581, 2014 | 70 | 2014 |
| Phase-locked loops that share a loop filter FW Kuo, SA Chi, C Huan-Neng, YJ Chen, CP Jou US Patent 8,547,151, 2013 | 61 | 2013 |
| Bead for 2.5 D/3D chip packaging application FW Kuo, C Huan-Neng, CP Jou, DC Yeh, CT Wang US Patent 9,275,950, 2016 | 47 | 2016 |
| A 12mW all-digital PLL based on class-F DCO for 4G phones in 28nm CMOS FW Kuo, R Chen, K Yen, HY Liao, CP Jou, FL Hsueh, M Babaie, ... 2014 Symposium on VLSI Circuits Digest of Technical Papers, 1-2, 2014 | 44 | 2014 |
| A 0.5-V 1.6-mW 2.4-GHz fractional-N all-digital PLL for Bluetooth LE with PVT-insensitive TDC using switched-capacitor doubler in 28-nm CMOS N Pourmousavian, FW Kuo, T Siriburanon, M Babaie, RB Staszewski IEEE Journal of Solid-State Circuits 53 (9), 2572-2583, 2018 | 43 | 2018 |
| Three-dimensional integrated circuit and method for wireless information access thereof MJ Wang, CP Jou, CN Peng, C Huan-Neng, HC Lin, KK Yen, H Chen, ... US Patent 9,086,452, 2015 | 39 | 2015 |
| Semiconductor package device with integrated antenna and manufacturing method thereof WS Liao, FW Kuo, CH Tung, CH Yu US Patent 10,460,987, 2019 | 36 | 2019 |
| A Bluetooth low-energy (BLE) transceiver with TX/RX switchable on-chip matching network, 2.75 mW high-IF discrete-time receiver, and 3.6 mW all-digital transmitter FW Kuo, SB Ferreira, M Babaie, R Chen, L Cho, CP Jou, FL Hsueh, ... 2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits), 1-2, 2016 | 31 | 2016 |
| PVT-free calibration circuit for TDC resolution in ADPLL FW Kuo, KK Yen, C Huan-Neng, L Hsien-Yuan, CP Jou, RB Staszewski US Patent 8,570,082, 2013 | 30 | 2013 |
| Phase locked loop (PLL) with multi-phase time-to-digital converter (TDC) KK Yen, FW Kuo, C Huan-Neng, L Hsien-Yuan, RB Staszewski US Patent 8,593,189, 2013 | 27 | 2013 |
| Auto frequency calibration for a phase locked loop and method of use YJ Chen, FW Kuo, C Huan-Neng, CP Jou US Patent 8,953,730, 2015 | 25 | 2015 |
| System design of a 2.75-mW discrete-time superheterodyne receiver for Bluetooth low energy SB Ferreira, FW Kuo, M Babaie, S Bampi, RB Staszewski IEEE Transactions on Microwave Theory and Techniques 65 (5), 1904-1913, 2017 | 24 | 2017 |
| Interposer and semiconductor package with noise suppression features FW Kuo, HY Lee, C Huan-Neng, YJ Chen, YL Lin, CP Jou US Patent App. 13/360,958, 2013 | 24 | 2013 |
| An all-digital PLL for cellular mobile phones in 28-nm CMOS with− 55 dBc fractional and− 91 dBc reference spurs FW Kuo, M Babaie, HNR Chen, LC Cho, CP Jou, M Chen, RB Staszewski IEEE Transactions on Circuits and Systems I: Regular Papers 65 (11), 3756-3768, 2018 | 21 | 2018 |
| A 0.5 V 1.6 mW 2.4 GHz fractional-N all-digital PLL for Bluetooth LE with PVT-insensitive TDC using switched-capacitor doubler in 28nm CMOS FW Kuo, S Pourmousavian, T Siriburanon, R Chen, L Cho, CP Jou, ... 2017 Symposium on VLSI Circuits, C178-C179, 2017 | 19 | 2017 |
| Lock detector and method of detecting lock status for phase lock loop FW Kuo, YEN Kyle, C Huan-Neng, YJ Chen, CP Jou US Patent 8,456,207, 2013 | 18 | 2013 |
Robert Bogdan StaszewskiUniversity College Dublin (UCD)在 ucd.ie 的电子邮件经过验证
