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GEORGIOS KAMPITSIS
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引用次数
引用次数
年份
Co-designing electronics with microfluidics for more sustainable cooling
R Van Erp, R Soleimanzadeh, L Nela, G Kampitsis, E Matioli
Nature 585 (7824), 211-216, 2020
5892020
Variable frequency controller for inductive power transfer in dynamic conditions
E Gati, G Kampitsis, S Manias
IEEE Transactions on power electronics 32 (2), 1684-1696, 2016
2062016
Power reserves control for PV systems with real-time MPP estimation via curve fitting
EI Batzelis, GE Kampitsis, SA Papathanassiou
IEEE Transactions on Sustainable Energy 8 (3), 1269-1280, 2017
1842017
Direct MPP calculation in terms of the single-diode PV model parameters
EI Batzelis, GE Kampitsis, SA Papathanassiou, SN Manias
IEEE Transactions on Energy Conversion 30 (1), 226-236, 2014
1382014
Fully soft-switched high step-up nonisolated three-port DC–DC converter using GaN HEMTs
R Faraji, H Farzanehfard, G Kampitsis, M Mattavelli, E Matioli, M Esteki
IEEE Transactions on Industrial Electronics 67 (10), 8371-8380, 2019
652019
Efficient microchannel cooling of multiple power devices with compact flow distribution for high power-density converters
R Van Erp, G Kampitsis, E Matioli
IEEE Transactions on Power Electronics 35 (7), 7235-7245, 2019
552019
Multi-channel tri-gate GaN power Schottky diodes with low ON-resistance
J Ma, G Kampitsis, P Xiang, K Cheng, E Matioli
IEEE Electron Device Letters 40 (2), 275-278, 2018
542018
Forced current balancing of parallel-connected SiC JFETs during forward and reverse conduction mode
SG Kokosis, IE Andreadis, GE Kampitsis, P Pachos, S Manias
IEEE Transactions on Power Electronics 32 (2), 1400-1410, 2016
392016
Ultra-compact, high-frequency power integrated circuits based on GaN-on-Si Schottky barrier diodes
L Nela, R Van Erp, G Kampitsis, HK Yildirim, J Ma, E Matioli
IEEE Transactions on Power Electronics 36 (2), 1269-1273, 2020
362020
A manifold microchannel heat sink for ultra-high power density liquid-cooled converters
R van Erp, G Kampitsis, E Matioli
2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 1383-1389, 2019
312019
Comparative evaluation of the short-circuit withstand capability of 1.2 kV silicon carbide (SiC) power transistors in real life applications
G Kampitsis, S Papathanassiou, S Manias
Microelectronics Reliability 55 (12), 2640-2646, 2015
312015
Fast-switching tri-anode Schottky barrier diodes for monolithically integrated GaN-on-Si power circuits
L Nela, G Kampitsis, J Ma, E Matioli
IEEE Electron Device Letters 41 (1), 99-102, 2019
302019
Wireless phase-locked loop control for inductive power transfer systems
E Gati, G Kampitsis, I Stavropoulos, S Papathanassiou, S Manias
2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 1601-1607, 2015
292015
Analysis of large-signal output capacitance of transistors using Sawyer–Tower circuit
N Perera, G Kampitsis, R Van Erp, J Ancay, A Jafari, MS Nikoo, E Matioli
IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (3 …, 2020
242020
Embedded microchannel cooling for high power-density GaN-on-Si power integrated circuits
R van Erp, G Kampitsis, L Nela, RS Ardebili, E Matioli
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
232020
Performance consideration of an AC coupled gate drive circuit with forward bias for normally-on SiC JFETs
G Kampitsis, S Papathanassiou, S Manias
2013 IEEE Energy Conversion Congress and Exposition, 3224-3229, 2013
172013
Ultra-high power density magnetic-less DC/DC converter utilizing GaN transistors
G Kampitsis, R van Erp, E Matioli
2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 1609-1615, 2019
142019
An accurate Matlab/Simulink based SiC MOSFET model for power converter applications
G Kampitsis, M Antivachis, S Kokosis, S Papathanassiou, S Manias
2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 1058-1064, 2015
142015
A clamping-circuit-based voltage measurement system for high-frequency flying capacitor multilevel inverters
G Kampitsis, EI Batzelis, PD Mitcheson, BC Pal
IEEE Transactions on Power Electronics 37 (10), 12301-12315, 2022
132022
Bringing the heat sink closer to the heat: Evaluating die-embedded microchannel cooling of GaN-on-Si power devices
R van Erp, G Kampitsis, L Nela, R Soleimanzadeh, N Perera, E Matioli
2020 26th International Workshop on Thermal Investigations of ICs and …, 2020
132020
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