| Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects L Spinella, M Park, J Im, P Ho, N Tamura, T Jiang 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 14 | 2016 |
| Semiconductor package UH Lee, MG Cho, P Mi-Seok, SH Park, HS Lim, JH Choi, F Atsushi US Patent App. 13/733,446, 2013 | 12 | 2013 |
| Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections MS Park, DH Nam, KM Jung, KS Hong, HS Kwon RSC advances 7 (37), 23136-23142, 2017 | 11 | 2017 |
| Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution SK Oh, YJ Kim, KM Jung, MS Park, MY Shon, HS Kwon Metals and Materials International 24, 67-72, 2018 | 5 | 2018 |
| Electrochemical migration behavior of a fine-pitch IC substrate by alternating current JS Kim, MS Park, DH Nam, HS Kwon Journal of Nanoscience and Nanotechnology 14 (11), 8258-8263, 2014 | 4 | 2014 |
| Wafer cleaning apparatus P Mi-Seok, Y Kwon, J Cho, NH Huh, S Soon-Hwan US Patent App. 11/834,549, 2008 | 2 | 2008 |
| Study on Interface Engineering of TiN/SiO2 Layers to Reduce the Parasitic Capacitance in CMOS Circuits S Kim, J Bae, M Park, YI Kwon, DH Han, UH Lee, Y Koo Electrochemical Society Meeting Abstracts 235, 1179-1179, 2019 | | 2019 |
| Effects of Microstructure of Nickel Electrodeposits on the Growth of Tin-Nickel Intermetallic Compound and Joint Reliability MS Park, TS Ryu, SS Lee, KS Kim, HS Kwon Electrochemical Society Meeting Abstracts 233, 1266-1266, 2018 | | 2018 |
| Effects of microstructure of electrodeposits (Sn, Cu and Ni) on the reliability of three-dimensional interconnections MS Park 한국과학기술원, 2017 | | 2017 |
| Electrochemical Synthesis of Graphene-Metal Oxide Heterostructure for Resistive Random Access Memory MS Park, KS Hong, SH Ahn, HS Kwon Electrochemical Society Meeting Abstracts 225, 1272-1272, 2014 | | 2014 |
| 미세탐침기반 기계-화학적 리소그래피공정을 이용한 3 차원 미세 구조물 제작에 관한 기초 연구 박미석， 성인하， 김대은， 장원석 한국정밀공학회 학술발표대회 논문집, 128-128, 2004 | | 2004 |
| 미세유로채널의 새로운 제작공정 및 표면상태가 유동에 미치는 영향 박미석， 김진산， 성인하， 김대은， 신보성 Journal of the Korean Society for Precision Engineering 21 (1), 87-93, 2004 | | 2004 |
| Novel Fabrication Process for Micro-Fluidic Channels and the Effect of the Surface States on the Fluid Flow MSP J-S Kim, I-H Sung, D-E Kim JOURNAL-KOREAN SOCIETY OF PRECISION ENGINEERING 21 (1), 87-93, 2004 | | 2004 |
| 초소형 공중발사 로켓 기본설계에 DMU (Digital Mock-up) 적용 방안에 대한 연구 박미석， 이승원， 이재우 한국항공우주학회 학술발표회 초록집, 910-914, 2002 | | 2002 |
Do-Hwan NamScientist III, Department of Chemistry, University of Wisconsin-Madison在 wisc.edu 的电子邮件经过验证
