| A review of mechanical properties of lead-free solders for electronic packaging H Ma, JC Suhling Journal of materials science 44 (5), 1141-1158, 2009 | 707 | 2009 |
| Silicon piezoresistive stress sensors and their application in electronic packaging JC Suhling, RC Jaeger IEEE sensors journal 1 (1), 14-30, 2001 | 388 | 2001 |
| Piezoresistive stress sensors for structural analysis of electronic packages DA Bittle, JC Suhling, RE Beaty, RC Jaeger, RW Johnson | 273 | 1991 |
| Reliability of the aging lead free solder joint H Ma, JC Suhling, P Lall, MJ Bozack 56th Electronic Components and Technology Conference 2006, 16 pp., 2006 | 235 | 2006 |
| The influence of elevated temperature aging on reliability of lead free solder joints H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack 2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007 | 233 | 2007 |
| CMOS stress sensors on [100] silicon RC Jaeger, JC Suhling, R Ramani, AT Bradley, J Xu IEEE journal of solid-state circuits 35 (1), 85-95, 2000 | 209 | 2000 |
| Determination of Anand constants for SAC solders using stress-strain or creep data M Motalab, Z Cai, JC Suhling, P Lall 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 208 | 2012 |
| Piezoresistive characteristics of short-channel MOSFETs on (100) silicon AT Bradley, RC Jaeger, JC Suhling, KJ O'Connor IEEE Transactions on electron devices 48 (9), 2009-2015, 2001 | 195 | 2001 |
| The effects of aging temperature on SAC solder joint material behavior and reliability Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack 2008 58th Electronic Components and Technology Conference, 99-112, 2008 | 192 | 2008 |
| Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006 | 182 | 2006 |
| Reduction of lead free solder aging effects using doped SAC alloys Z Cai, Y Zhang, JC Suhling, P Lall, RW Johnson, MJ Bozack 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 181 | 2010 |
| Model for BGA and CSP reliability in automotive underhood applications P Lall, MN Islam, N Singh, JC Suhling, R Darveaux IEEE Transactions on Components and Packaging Technologies 27 (3), 585-593, 2004 | 172 | 2004 |
| Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture RE Beaty, RC Jaeger, JC Suhling, RW Johnson, RD Butler IEEE Transactions on Components Hybrids and Manufacturing Technology 15 (5 …, 1992 | 167 | 1992 |
| Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling P Lall, S Gupte, P Choudhary, J Suhling IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007 | 162 | 2007 |
| Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon RC Jaeger, JC Suhling, R Ramani IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994 | 147 | 1994 |
| Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies P Lall, P Choudhary, S Gupte, J Suhling 56th Electronic Components and Technology Conference 2006, 10 pp., 2006 | 142 | 2006 |
| Improved predictions of lead free solder joint reliability that include aging effects M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall 2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012 | 138 | 2012 |
| Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling IEEE Transactions on Components and Packaging Technologies 31 (1), 104-113, 2008 | 137 | 2008 |
| Prognostics and health management of electronic packaging P Lall, MN Islam, MK Rahim, JC Suhling IEEE Transactions on Components and Packaging Technologies 29 (3), 666-677, 2006 | 136 | 2006 |
| Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ... IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 2013 | 133 | 2013 |
Pradeep LallAuburn University在 auburn.edu 的电子邮件经过验证
