受强制性开放获取政策约束的文章 - Jordan C. Roberts了解详情
无法在其他位置公开访问的文章：3 篇
Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments
J Chen, Q Nguyen, JC Roberts, JC Suhling, RC Jaeger, P Lall
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
A study on die stresses in flip chip package subjected to various hygrothermal exposures
Q Nguyen, JC Roberts, JC Suhling, RC Jaeger, P Lall
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
A study of moisture and thermally induced die stresses in plastic ball grid array packages
Q Nguyen, JC Roberts, JC Suhling, RC Jaeger
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
强制性开放获取政策： US National Science Foundation
可在其他位置公开访问的文章：4 篇
The Anand parameters for SAC solders after extreme aging
M Basit, S Ahmed, M Motalab, JC Roberts, JC Suhling, P Lall
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
强制性开放获取政策： US National Science Foundation
Characterization of moisture induced die stresses in flip chip packaging
Q Nguyen, JC Roberts, JC Suhling, RC Jaeger, P Lall
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 789-798, 2016
强制性开放获取政策： US National Science Foundation
Measurement and simulation of moisture induced die stresses in quad flat packages
Q Nguyen, JC Roberts, JC Suhling, RC Jaeger
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
强制性开放获取政策： US National Science Foundation
Reliability of a CBGA miroproessor package incorpoating a decoupling capacitor array
J Roberts, C Bhat, JC Suhling, RC Jaeger, P Lall
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
强制性开放获取政策： US National Science Foundation
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