| Detection and location of defects in electronic devices by means of scanning ultrasonic microscopy and the wavelet transform L Angrisani, L Bechou, D Dallet, P Daponte, Y Ousten Measurement 31 (2), 77-91, 2002 | 56 | 2002 |
| Long‐term Reliability Prediction of 935 nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests Y Deshayes, L Bechou, F Verdier, Y Danto Quality and Reliability Engineering International 21 (6), 571-594, 2005 | 48 | 2005 |
| Study of a polymer optical microring resonator for hexavalent chromium sensing F Meziane, V Raimbault, H Hallil, S Joly, V Conédéra, JL Lachaud, ... Sensors and Actuators B: Chemical 209, 1049-1056, 2015 | 42 | 2015 |
| Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses R Baillot, Y Deshayes, L Bechou, T Buffeteau, I Pianet, C Armand, ... Microelectronics reliability 50 (9-11), 1568-1573, 2010 | 30 | 2010 |
| An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy L Bechou, D Dallet, Y Danto, P Daponte, Y Ousten, S Rapuano IEEE Transactions on Instrumentation and Measurement 52 (1), 135-142, 2003 | 24 | 2003 |
| Ultrasonic images interpretation improvement for microassembling technologies characterisation L Bechou, Y Ousten, B Tregon, F Marc, Y Danto, R Even, P Kertesz Microelectronics Reliability 37 (10-11), 1787-1790, 1997 | 24 | 1997 |
| Highly accelerated life testing (HALT), failure oriented accelerated testing (FOAT), and their role in making a viable device into a reliable product E Suhir, A Bensoussan, J Nicolics, L Bechou 2014 IEEE Aerospace Conference, Big Sky, Montana, 2014 | 23 | 2014 |
| Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov (BAZ) Model E Suhir, L Bechou, A Bensoussan Printed Circuit Design& Fab/Circuits Assembly 29 (12), 25-28, 2012 | 23 | 2012 |
| Estimation of lifetime distributions on 1550-nm DFB laser diodes using Monte-Carlo statistic computations Y Deshayes, F Verdier, L Bechou, B Tregon, Y Danto, D Laffitte, ... Reliability of Optical Fiber Components, Devices, Systems, and Networks II …, 2004 | 22 | 2004 |
| Early failure signatures of 1310 nm laser modules using electrical, optical and spectral measurements Y Deshayes, L Bechou, L Mendizabal, Y Danto Measurement 34 (2), 157-178, 2003 | 21 | 2003 |
| Predicted size of an inelastic zone in a ball-grid-array assembly E Suhir, L Bechou, B Levrier Journal of Applied Mechanics 80 (2), 021007, 2013 | 20 | 2013 |
| Miniaturization of InGaP/InGaAs/Ge solar cells for micro‐concentrator photovoltaics P Albert, A Jaouad, G Hamon, M Volatier, CE Valdivia, Y Deshayes, ... Progress in Photovoltaics: Research and Applications 29 (9), 990-999, 2021 | 19 | 2021 |
| Probabilistic design for reliability (pdfr) and a novel approach to qualification testing (qt) E Suhir, R Mahajan, A Lucero, L Bechou IEEE/AIAA Aerospace Conf., 3843-3860, 2012 | 19 | 2012 |
| Measurement of the thermal characteristics of packaged double-heterostructure light emitting diodes for space applications using spontaneous optical spectrum properties L Bechou, O Rehioui, Y Deshayes, O Gilard, G Quadri, Y Ousten Optics & Laser Technology 40 (4), 589-601, 2008 | 19 | 2008 |
| Precise facet temperature distribution of high-power laser diodes: Unpumped window effect J Michaud, P Del Vecchio, L Béchou, D Veyrié, MA Bettiati, F Laruelle, ... IEEE Photonics Technology Letters 27 (9), 1002-1005, 2015 | 18 | 2015 |
| Availability index and minimized reliability cost E Suhir, L Bechou Circuit Assemblies, 2013 | 18 | 2013 |
| Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy L Bechou, L Angrisiani, Y Ousten, D Dallet, H Levi, P Daponte, Y Danto Microelectronics Reliability 39 (6-7), 1095-1101, 1999 | 18 | 1999 |
| Non‐destructive detection and localization of defects in multilayer ceramic chip capacitors using electromechanical resonances L Bechou, S Mejdi, Y Ousten, Y Danto Quality and reliability engineering international 12 (1), 43-53, 1996 | 18 | 1996 |
| Crack propagation modeling in silicon: a comprehensive thermomechanical finite-element model approach for power devices D Calvez, F Roqueta, S Jacques, L Bechou, Y Ousten, S Ducret IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (2 …, 2013 | 17 | 2013 |
| Durability study of a fluorescent optical memory in glass studied by luminescence spectroscopy A Royon, K Bourhis, L Béchou, T Cardinal, L Canioni, Y Deshayes Microelectronics Reliability 53 (9-11), 1514-1518, 2013 | 17 | 2013 |
