Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) A Naeemi, R Sarvari, JD Meindl IEEE Electron Device Letters 26 (2), 84-86, 2005 | 396 | 2005 |
Accurate analysis of carbon nanotube interconnects using transmission line model D Fathi, B Forouzandeh, S Mohajerzadeh, R Sarvari Micro & Nano Letters 4 (2), 116-121, 2009 | 56 | 2009 |
IntSim: A CAD tool for optimization of multilevel interconnect networks DC Sekar, A Naeemi, R Sarvari, JA Davis, JD Meindl 2007 IEEE/ACM International Conference on Computer-Aided Design, 560-567, 2007 | 48 | 2007 |
On-chip interconnect networks at the end of the roadmap: Limits and nanotechnology opportunities A Naeemi, R Sarvari, JD Meindl 2006 International Interconnect Technology Conference, 201-203, 2006 | 44 | 2006 |
Performance comparison between carbon nanotube and copper interconnects for GSI A Naeemi, R Sarvari, JD Meindl IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004 | 39 | 2004 |
Ethanol sensing properties of PVP electrospun membranes studied by quartz crystal microbalance MM Aria, A Irajizad, FR Astaraei, SP Shariatpanahi, R Sarvari Measurement 78, 283-288, 2016 | 35 | 2016 |
Performance modeling and optimization for single-and multi-wall carbon nanotube interconnects A Naeemi, R Sarvari, JD Meindl Proceedings of the 44th Annual Design Automation Conference, 568-573, 2007 | 32 | 2007 |
The impact of size effects and copper interconnect process variations on the maximum critical path delay of single and multi-core microprocessors G Lopez, R Murali, R Sarvari, K Bowman, J Davis, J Meindl 2007 IEEE International Interconnect Technology Conferencee, 40-42, 2007 | 23 | 2007 |
Impact of size effects on the resistivity of copper wires and consequently the design and performance of metal interconnect networks R Sarvari, A Naeemi, R Venkatesan, JD Meindl Proceedings of the IEEE 2005 International Interconnect Technology …, 2005 | 23 | 2005 |
Temperature-dependent comparison between delay of CNT and copper interconnects A Alizadeh, R Sarvari IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (2), 803-807, 2015 | 17 | 2015 |
Impact of size effects and anomalous skin effect on metallic wires as GSI interconnects R Sarvari Georgia Institute of Technology, 2009 | 16 | 2009 |
Investigation of quantum conductance in semiconductor single-wall carbon nanotubes: Effect of strain and impurity H Rabiee Golgir, R Faez, M Pazoki, H Karamitaheri, R Sarvari Journal of Applied Physics 110 (6), 2011 | 14 | 2011 |
Two-dimensional bipolar junction transistors B Gharekhanlou, S Khorasani, R Sarvari Materials Research Express 1 (1), 015604, 2014 | 12 | 2014 |
On temperature dependency of delay for local, intermediate, and repeater inserted global copper interconnects A Alizadeh, R Sarvari IEEE transactions on very large scale integration (VLSI) systems 23 (12 …, 2014 | 11 | 2014 |
New approach to VLSI buffer modeling, considering overshooting effect M Mehri, MHM Kouhani, N Masoumi, R Sarvari IEEE Transactions on very large scale integration (VLSI) systems 21 (8 …, 2012 | 11 | 2012 |
Design and optimization for nanoscale power distribution networks in gigascale systems R Sarvari, A Naeemi, P Zarkesh-Ha, JD Meindl 2007 IEEE International Interconnect Technology Conferencee, 190-192, 2007 | 11 | 2007 |
On the study of anomalous skin effect for GSI interconnections R Sarvari, JD Meindl Proceedings of the IEEE 2003 International Interconnect Technology …, 2003 | 9 | 2003 |
Flexible strain sensors based on electrostatically actuated graphene flakes S Fardindoost, A Alipour, S Mohammadi, S Gokyar, R Sarvari, HV Demir Journal of Micromechanics and Microengineering 25 (7), 075016, 2015 | 8 | 2015 |
Electrical and optical chip I/O interconnections for gigascale systems MS Bakir, B Dang, OOA Ogunsola, R Sarvari, JD Meindl IEEE transactions on electron devices 54 (9), 2426-2437, 2007 | 8 | 2007 |
General compact model for bit-rate limit of electrical interconnects considering DC resistance, skin effect and surface scattering R Sarvari, A Naeemi, JD Meindl Proceedings of the IEEE 2004 International Interconnect Technology …, 2004 | 8 | 2004 |