| Voids investigation in solder joints performed with vapour phase soldering (VPS) B Kinga Synkiewicz, A Skwarek, K Witek Soldering & Surface Mount Technology 26 (1), 8-11, 2014 | 67 | 2014 |
| Influence of processing on microstructure and electrical characteristics of multilayer varistors D Szwagierczak, J Kulawik, A Skwarek Journal of Advanced Ceramics 8, 408-417, 2019 | 37 | 2019 |
| Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ... Nanomaterials 11 (6), 1545, 2021 | 35 | 2021 |
| Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly B Synkiewicz, A Skwarek, K Witek Materials science in semiconductor processing 38, 346-351, 2015 | 34 | 2015 |
| Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies A Skwarek, P Ptak, K Górecki, T Hurtony, B Illés Materials 13 (7), 1563, 2020 | 28 | 2020 |
| Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, O Krammer, D Bušek International Journal of heat and mass transfer 114, 613-620, 2017 | 28 | 2017 |
| Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering B Illés, A Géczy, A Skwarek, D Busek International Journal of Heat and Mass Transfer 101, 69-75, 2016 | 28 | 2016 |
| Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress A Skwarek, M Pluska, J Ratajczak, A Czerwinski, K Witek, ... Materials Science and Engineering: B 176 (4), 352-357, 2011 | 24 | 2011 |
| High temperature thermogenerators made on DBC substrate using vapour phase soldering A Skwarek, B Synkiewicz, J Kulawik, P Guzdek, K Witek, J Tarasiuk Soldering & Surface Mount Technology 27 (3), 125-128, 2015 | 22 | 2015 |
| Fabrication and characterization of bulk and thick film perovskite NTC thermistors J Kulawik, D Szwagierczak, B Gröger, A Skwarek Microelectronics international 24 (2), 14-18, 2007 | 22 | 2007 |
| Occurrence of tin pest on the surface of tin‐rich lead‐free alloys A Skwarek, M Sroda, M Pluska, A Czerwinski, J Ratajczak, K Witek Soldering & surface mount technology 23 (3), 184-190, 2011 | 20 | 2011 |
| The influence of the crystallographic structure of the intermetallic grains on tin whisker growth B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek Journal of Alloys and Compounds 785, 774-780, 2019 | 19 | 2019 |
| Analysis of polymer foil heaters as infrared radiation sources K Witek, T Piotrowski, A Skwarek Materials Science and Engineering: B 177 (15), 1373-1377, 2012 | 19 | 2012 |
| Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress A Skwarek, J Ratajczak, A Czerwinski, K Witek, J Kulawik Applied surface science 255 (15), 7100-7103, 2009 | 19 | 2009 |
| Microstructural analysis of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder alloy after selective electrochemical etching MZ Yahaya, MFM Nazeri, S Kheawhom, B Illés, A Skwarek, AA Mohamad Materials Research Express 7 (1), 016583, 2020 | 17 | 2020 |
| Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints A Skwarek, B Illés, P Górecki, A Pietruszka, J Tarasiuk, T Hurtony Journal of Materials Research and Technology 22, 403-412, 2023 | 16 | 2023 |
| Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys A Skwarek, M Pluska, A Czerwinski, K Witek Materials Science and Engineering: B 177 (15), 1286-1291, 2012 | 16 | 2012 |
| Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy International Journal of Heat and Mass Transfer 184, 122268, 2022 | 15 | 2022 |
| Whisker growth from vacuum evaporated submicron Sn thin films B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ... Surface and Coatings Technology 311, 216-222, 2017 | 15 | 2017 |
| Inoculator dependent induced growth of α-Sn A Skwarek, P Zachariasz, J Kulawik, K Witek Materials Chemistry and Physics 166, 16-19, 2015 | 15 | 2015 |
Balazs IllesFull Professor of Budapest University of Technology and Economics在 ett.bme.hu 的电子邮件经过验证
