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Yuandong Guo
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引用次数
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年份
Simultaneous measurement of electric and magnetic fields with a dual probe for efficient near-field scanning
W Shao, W Fang, Y Huang, G Li, L Wang, Z He, E Shao, Y Guo, Y En, ...
IEEE Transactions on Antennas and Propagation 67 (4), 2859-2864, 2019
652019
Multi-Ports ([) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization
B Chen, J He, Y Guo, S Pan, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 61 (4), 1261-1270, 2019
322019
电磁兼容设计与整改对策及案例分析
郭远东朱文立,陈燕,肖猛,
Publishing House of Electronics Industry (China), 2012
29*2012
IEC 61000-4-2 ESD test in display down configurationfor cell phones
J Zhou, S Shinde, Y Guo, A Talebzadeh, S Marathe, Y Gan, KH Kim, ...
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
212016
Systematic characterization of dual probes for electromagnetic near-field measurement
W Shao, X Tian, R Chen, X He, W Fang, P Lai, G Lu, Y Guo, L Wang, ...
IEEE Sensors Journal 21 (4), 4713-4722, 2020
202020
Differential S-parameter de-embedding for 8-port network
B Chen, J He, X Sun, Y Guo, S Jin, X Ye, J Fan
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
202018
Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack
S Yang, B Orr, Y Guo, Y Zhang, D Pommerenke, H Shumiya, J Maeshima, ...
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 41-45, 2016
162016
A cross-sectional profile based model for stripline conductor surface roughness
S Yong, V Khilkevich, Y Liu, R He, Y Guo, H Gao, S Hinaga, D Padilla, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
132020
Measurement techniques to identify soft failure sensitivity to ESD
J Zhou, Y Guo, S Shinde, A Hosseinbeig, A Patnaik, OH Izadi, C Zeng, ...
IEEE transactions on electromagnetic compatibility 62 (4), 1007-1016, 2019
132019
Investigation of segmentation method for enhancing high frequency simulation accuracy of Q3D extractor
C Che, H Zhao, Y Guo, J Hu, H Kim
2019 IEEE International Conference on Computational Electromagnetics (ICCEM …, 2019
132019
Limitations of first-order surface impedance boundary condition and its effect on 2D simulations for PCB transmission lines
Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
122020
Causality analyzing for transmission line with surface roughness
X Sun, Y Guo, Y Sun, K Song, L Ye, X Ye, JL Drewniak, J Fan
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
122019
Study of TDR impedance for better analysis to measurement correlation
Y Guo, B Chen, X Sun, X Ye, J Hsu, J Fan
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo …, 2019
112019
Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent
Y Guo, S Yong, Y Liu, J He, B Pu, X Ye, A Sutono, V Kunda, A Luoh, ...
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 820-824, 2021
92021
The simulated TDR impedance in PCB material characterization
Y Guo, DH Kim, J He, S Yong, Y Liu, B Pu, X Ye, J Fan
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 831-834, 2021
82021
Far-end crosstalk analysis for stripline with inhomogeneous dielectric layers (IDL)
Y Liu, S Yong, Y Guo, J He, L Liu, N Kutheis, A Sutono, V Kunda, A Luoh, ...
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 825-830, 2021
82021
Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin
B Pu, J He, A Harmon, Y Guo, Y Liu, Q Cai
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 492-497, 2021
82021
Robust extended unterminated line (EUL) crosstalk characterization techniques for high-speed interconnect
Y Guo, DH Kim, J He, X Ye, A Sutono, V Kunda, A Luoh, Z Kiguradze, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
82020
An empirical modeling of far-end crosstalk and insertion loss in microstrip lines
Y Liu, S Yong, Y Guo, J He, C Li, X Ye, J Fan, V Khilkevich, DH Kim
IEEE Transactions on Signal and Power Integrity 1, 130-139, 2022
62022
Ground bridge effect on reduction of conducted emission from three-phase motor drive system
Y Guo, S Penugonda, M Kim, J Lee, J Ha, S Yun, J Fan, H Kim
2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019
62019
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