| Transient directional solidification of a eutectic Al–Si–Ni alloy: macrostructure, microstructure, dendritic growth and hardness R Kakitani, CB Cruz, TS Lima, C Brito, A Garcia, N Cheung Materialia 7, 100358, 2019 | 30 | 2019 |
| Horizontally Solidified Al–3 wt% Cu–(0.5 wt% Mg) Alloys: Tailoring Thermal Parameters, Microstructure, Microhardness, and Corrosion Behavior A Barros, C Cruz, AP Silva, N Cheung, A Garcia, O Rocha, A Moreira Acta Metallurgica Sinica (English Letters) 32, 695-709, 2019 | 25 | 2019 |
| Directional solidification of a Sn-0.2 Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and … MGC Xavier, CB Cruz, R Kakitani, BL Silva, A Garcia, N Cheung, ... Journal of Alloys and Compounds 723, 1039-1052, 2017 | 19 | 2017 |
| Length scale of solidification microstructure tailoring corrosion resistance and microhardness in T6 heat treatment of an Al–Cu–Mg alloy A Barros, C Cruz, AP Silva, N Cheung, A Garcia, O Rocha, A Moreira Corrosion Engineering, Science and Technology 55 (6), 471-479, 2020 | 15 | 2020 |
| Corrosion behavior of an Al–Sn–Zn alloy: Effects of solidification microstructure characteristics A Barros, C Cruz, A Garcia, N Cheung Journal of Materials Research and Technology 12, 257-263, 2021 | 14 | 2021 |
| Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys WLR Santos, CB Cruz, JE Spinelli, N Cheung, A Garcia Materials Science and Engineering: A 712, 127-132, 2018 | 14 | 2018 |
| Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7 Cu solder alloy/substrate couples T Soares, C Cruz, B Silva, C Brito, A Garcia, JE Spinelli, N Cheung Journal of Electronic Materials 49, 173-187, 2020 | 12 | 2020 |
| Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni alloys CB Cruz, R Kakitani, MGC Xavierb, BL Silva, A Garcia, N Cheung, ... Materials Research 21, e20171099, 2018 | 12 | 2018 |
| Fatigue Failure Analysis of a Speed Reduction Shaft RS Miranda, C Cruz, N Cheung, A Cunha Metals 11 (6), 856, 2021 | 11 | 2021 |
| Microstructure growth morphologies, macrosegregation, and microhardness in Bi–Sb thermal interface alloys T Soares, C Cruz, A Barros, A Garcia, N Cheung Advanced Engineering Materials 22 (6), 1901592, 2020 | 11 | 2020 |
| Thermal conductance at Sn-0.5 mass% Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth R Oliveira, C Cruz, A Barros, F Bertelli, JE Spinelli, A Garcia, N Cheung Journal of Thermal Analysis and Calorimetry 147 (8), 4945-4958, 2022 | 10 | 2022 |
| Plate-like growth in a eutectic Bi–Ni alloy: Effects of morphological microstructure evolution and Bi3Ni intermetallic phase on tensile properties C Cruz, T Lima, R Kakitani, A Barros, A Garcia, N Cheung Journal of Materials Research and Technology 9 (3), 4940-4950, 2020 | 10 | 2020 |
| Effect of microstructure features on the corrosion behavior of the Sn-2.1 wt% Mg solder alloy C Cruz, T Lima, M Soares, E Freitas, E Fujiwara, A Garcia, N Cheung Electronic Materials Letters 16, 276-292, 2020 | 10 | 2020 |
| Solidification microstructure-dependent hydrogen generation behavior of Al–Sn and Al–Fe alloys in alkaline medium C Konno, C Cruz, T Costa, A Barros, P Goulart, A Garcia, N Cheung International Journal of Hydrogen Energy 46 (24), 12654-12671, 2021 | 8 | 2021 |
| Sn-0.5 Cu (-x) Al solder alloys: Microstructure-related aspects and tensile properties responses TS Lima, GL de Gouveia, R da Silva Septimio, CB da Cruz, BL Silva, ... Metals 9 (2), 241, 2019 | 5 | 2019 |
| Interface evaluation of a Bi–Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance R Septimio, C Cruz, M Xavier, T Lima, A Garcia, JE Spinelli, N Cheung International Journal of Thermal Sciences 160, 106685, 2021 | 3 | 2021 |
| Tailoring the hydrogen production behavior of Al-Zn-Sn alloys through their as-solidified microstructures A Barros, C Cruz, C Konno, A Conde, H Henein, A Garcia, N Cheung International Journal of Hydrogen Energy, 2024 | 2 | 2024 |
| Dry Sliding Wear Features of an Al-20Sn-5Zn Alloy Affected by Microstructural Length Scales A Barros, C Cruz, T Botelho, A Silva, L Casteletti, A Garcia, N Cheung Lubricants 10 (12), 352, 2022 | 2 | 2022 |
| Microstructural and segregation effects affecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution R Septimio, C Cruz, B Silva, A Garcia, JE Spinelli, N Cheung Journal of Applied Electrochemistry 51, 769-780, 2021 | 2 | 2021 |
| Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness CB Da Cruz, TS Lima, TA Costa, C Brito, A Garcia, N Cheung Materials Research Express 6 (12), 126562, 2019 | 2 | 2019 |
