| Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging VK Bajpai, H Pandey, T Singh, P Dixit Materials Letters 316, 132033, 2022 | 10 | 2022 |
| Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating H Pandey, T Singh, P Dixit Journal of Manufacturing Processes 82, 569-584, 2022 | 8 | 2022 |
| Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining H Pandey, A Apurva, P Dixit Journal of Manufacturing Processes 124, 52-67, 2024 | | 2024 |
| Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation K Pawar, H Pandey, P Dixit IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Through Glass Vias Fabrication using Ultrasonic Micromachining and Electroless Deposition H Pandey, K Pawar, P Dixit 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023 | | 2023 |
| Numerical and Experimental Analysis of Ultrasonic Micromachining to Create Through-Holes in Semiconductor Substrates H Pandey, P Dixit International Conference on Precision, Meso, Micro and Nano Engineering …, 2022 | | 2022 |
| Electrochemical Discharge-assisted Roughening to Improve the Adhesion of Electroless Nickel with Glass Substrate K Pawar, H Pandey, P Dixit International Conference on Precision, Meso, Micro and Nano Engineering …, 2022 | | 2022 |
| Adhesion improvement of the electroless film deposited on glass by the Ultrasonic micromachining process H Pandey, K Pawar, P Dixit 5th World Congress on Micro and Nano Manufacturing WCMNM 2022, Leuven, Belgium, 2022 | | 2022 |
Pradeep DixitIIT Bombay India, NTU Singapore, VTT Finland在 iitb.ac.in 的电子邮件经过验证
Pradeep DixitIIT Bombay India, NTU Singapore, VTT Finland在 iitb.ac.in 的电子邮件经过验证
Karan PawarIndian Institute of Technology Bombay在 iitb.ac.in 的电子邮件经过验证