| Mechanical properties of Sn-58 wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests CJ Lee, KD Min, HJ Park, SB Jung Journal of Alloys and Compounds 820, 153077, 2020 | 37 | 2020 |
| Mechanical, electrical, and thermal reliability of Sn-58wt.% Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment BG Park, WR Myung, CJ Lee, SB Jung Composites Part B: Engineering 182, 107617, 2020 | 30 | 2020 |
| Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages KH Jung, KD Min, CJ Lee, BG Park, H Jeong, JM Koo, B Lee, SB Jung Applied Surface Science 495, 143487, 2019 | 29 | 2019 |
| Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP) JH Kim, CJ Lee, KD Min, BU Hwang, DG Kang, DH Choi, J Joo, SB Jung Composite Structures 258, 113364, 2021 | 28 | 2021 |
| Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB J Kim, KH Jung, JH Kim, CJ Lee, SB Jung Journal of Alloys and Compounds 775, 581-588, 2019 | 27 | 2019 |
| Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant KH Jung, KD Min, CJ Lee, SB Jung Journal of Alloys and Compounds 781, 657-663, 2019 | 23 | 2019 |
| Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding HS Joo, CJ Lee, KD Min, BU Hwang, SB Jung Journal of Materials Science: Materials in Electronics 31, 22926-22932, 2020 | 21 | 2020 |
| Electromigration behavior of Cu core solder joints under high current density H Jeong, CJ Lee, JH Kim, J Son, SB Jung Electronic Materials Letters 16, 513-519, 2020 | 19 | 2020 |
| Hybrid transient liquid phase sintering bonding of Sn-3.0 Ag-0.5 Cu solder with added Cu and Ni for CuNi bonding KD Min, CJ Lee, BU Hwang, JH Kim, JH Jang, SB Jung Applied Surface Science 551, 149396, 2021 | 16 | 2021 |
| Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test H Jeong, KD Min, CJ Lee, JH Kim, SB Jung Microelectronics Reliability 112, 113918, 2020 | 16 | 2020 |
| Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package H Jeong, KH Jung, CJ Lee, KD Min, WR Myung, SB Jung Journal of Materials Science: Materials in Electronics 31, 6835-6842, 2020 | 16 | 2020 |
| Effect of Sn-decorated MWCNTs on the mechanical reliability of Sn–58Bi solder CJ Lee, KD Min, HJ Park, JH Kim, SB Jung Electronic Materials Letters 15, 693-701, 2019 | 16 | 2019 |
| Ultrafast photonic soldering with Sn–58Bi using intense pulsed light energy KH Jung, KD Min, CJ Lee, H Jeong, JH Kim, SB Jung Advanced Engineering Materials 22 (12), 2000179, 2020 | 13 | 2020 |
| Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics CJ Lee, BG Park, H Jeong, KH Jung, SB Jung Journal of Alloys and Compounds 794, 341-346, 2019 | 13 | 2019 |
| Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior CJ Lee, DG Kang, BU Hwang, KD Min, J Joo, SB Jung Journal of Alloys and Compounds 863, 158726, 2021 | 12 | 2021 |
| Enhancing adhesion strength of photonic sintered screen-printed Ag circuit by atmospheric pressure plasma BG Park, CJ Lee, SB Jung Microelectronic Engineering 202, 37-41, 2018 | 11 | 2018 |
| Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability BU Hwang, KH Jung, KD Min, CJ Lee, SB Jung Journal of Materials Science: Materials in Electronics 32, 3054-3065, 2021 | 10 | 2021 |
| Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package CJ Lee, WR Myung, BG Park, SB Jung Journal of Materials Science: Materials in Electronics 31, 10170-10176, 2020 | 10 | 2020 |
| The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder CJ Lee, KD Min, BU Hwang, JH Kim, SB Jung Current Applied Physics 19 (11), 1182-1186, 2019 | 9 | 2019 |
| Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung Journal of Alloys and Compounds 857, 157595, 2021 | 8 | 2021 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证