| Single‐vesicle imaging and co‐localization analysis for tetraspanin profiling of individual extracellular vesicles C Han, H Kang, J Yi, M Kang, H Lee, Y Kwon, J Jung, J Lee, J Park Journal of extracellular vesicles 10 (3), e12047, 2021 | 70 | 2021 |
| Multifluorescence single extracellular vesicle analysis by time-sequential illumination and tracking S Cho, J Yi, Y Kwon, H Kang, C Han, J Park ACS nano 15 (7), 11753-11761, 2021 | 29 | 2021 |
| Extracellular vesicles generated using bioreactors and their therapeutic effect on the acute kidney injury model H Kang, Y Bae, Y Kwon, S Kim, J Park Advanced Healthcare Materials 11 (4), 2101606, 2022 | 21 | 2022 |
| Methods to analyze extracellular vesicles at single particle level Y Kwon, J Park Micro and Nano Systems Letters 10 (1), 14, 2022 | 19 | 2022 |
| Effects of bending strain and crack direction on crack-based strain sensors Y Kwon, C Park, J Kim, H Kim, C Park, B Lee, Yeondo Jeong, S Cho Smart Materials and Structures 29 (11), 2020 | 18 | 2020 |
| Heterogeneous Subcellular Origin of Exosome-Mimetic Nanovesicles Engineered from Cells H Lee, H Kang, M Kang, C Han, J Yi, Y Kwon, J Park ACS Biomaterials Science & Engineering 6 (11), 6063-6068, 2020 | 10 | 2020 |
| Immunostaining extracellular vesicles based on an aqueous two-phase system: For analysis of tetraspanins J Lee, Y Kwon, J Jung, H Shin, J Park ACS Applied Bio Materials 4 (4), 3294-3303, 2021 | 7 | 2021 |
| Characterization of extracellular vesicle and virus-like particles by single vesicle tetraspanin analysis C Han, M Kang, H Kang, J Yi, M Lim, Y Kwon, J Park Sensors and Actuators B: Chemical 382, 133547, 2023 | 4 | 2023 |
| Cell‐engineered virus‐mimetic nanovesicles for vaccination against enveloped viruses C Han, S Kim, Y Seo, M Lim, Y Kwon, J Yi, SI Oh, M Kang, SG Jeon, ... Journal of Extracellular Vesicles 13 (4), e12438, 2024 | | 2024 |
| Method for manufacturing crack-based high sensitivity bending sensor SJ Cho, Y Kwon, C Park KR Patent 10-2,162,145, 2020 | | 2020 |
| Method of manufacturing crack-based strain sensor using electroless silver plating SJ Cho, J Lee, Y Kwon, C Park KR Patent 10-2,162,135, 2020 | | 2020 |
| 크랙 기반 스트레인 센서를 활용한 스마트 글러브 및 평가시스템 개발 S Cho, Y Kwon, H Moon, D Kim, J Kim, C Park, H Lee, H Jung, S Hong, ... 한국정밀공학회 학술발표대회 논문집, 697-697, 2018 | | 2018 |
Jaesung Parkpostech在 postech.ac.kr 的电子邮件经过验证
