Woo-Tae Park 个人学术档案 - 学术资源搜索

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	总计	2019 年至今
引用	5650	2615
h 指数	31	19
i10 指数	71	40

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Thomas KennyProfessor of Mechanical Engineering, Stanford University在 cdr.stanford.edu 的电子邮件经过验证
Rob CandlerUniversity of California, Los Angeles在 g.ucla.edu 的电子邮件经过验证
Yong-Jin YoonProfessor, Department of Mechanical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证
Aaron PartridgeFounder and Chief Scientist, SiTime Corp在 sitime.com 的电子邮件经过验证
Minkyu JeAssociate Professor, School of Electrical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证
Matthew A HopcroftGeorge Washington, Cambridge, Stanford, Berkeley, Hewlett-Packard在 mems.stanford.edu 的电子邮件经过验证
Le-Giang TranInternational Unversity, Vietnam National University - HCM在 hcmiu.edu.vn 的电子邮件经过验证
Hyouk-Kyu ChaProfessor, Seoul National University of Science and Technology在 seoultech.ac.kr 的电子邮件经过验证
li shiah limInstitute of Microelectronics在 ime.a-star.edu.sg 的电子邮件经过验证
Dr. Pushpapraj SinghAssociate Professor, Indian Institute of Technology, Delhi在 iitd.ac.in 的电子邮件经过验证
Chengkuo LeeGlobalFoundries Chair Professor in Eng., ECE Department, National University of Singapore在 nus.edu.sg 的电子邮件经过验证
Jianmin MiaoNanyang Technological University在 ntu.edu.sg 的电子邮件经过验证
T.Qua Nguyen在 hcmiu.edu.vn 的电子邮件经过验证
Beth L PruittUC Santa Barbara在 ucsb.edu 的电子邮件经过验证
Muhammad HamidullahFemto ST Institute在 femto-st.fr 的电子邮件经过验证
Ji-Seob ChoiSeoul national university science and technology Ph.D process在 seoultech.ac.kr 的电子邮件经过验证
Ming-Yuan CHENGInstitute Of Microelectronics, A*STAR在 ime.a-star.edu.sg 的电子邮件经过验证
Tao SunVirginia Tech在 vt.edu 的电子邮件经过验证
Holden LiAssociate Professor Nanyang Technological University在 ntu.edu.sg 的电子邮件经过验证
Inkyu ParkProfessor of Mechanical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证

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Woo-Tae Park

Professor, Seoul National University of Science and Technology, Korea

在 seoultech.ac.kr 的电子邮件经过验证 - 首页

MEMS Biomedical Engineering Nanotechnology


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
Semiconductor piezoresistance for microsystems AA Barlian, WT Park, JR Mallon, AJ Rastegar, BL Pruitt Proceedings of the IEEE 97 (3), 513-552, 2009	1076	2009
Polymeric biomaterials for medical implants and devices AJT Teo, A Mishra, I Park, YJ Kim, WT Park, YJ Yoon ACS Biomaterials Science & Engineering 2 (4), 454-472, 2016	745	2016
RF power harvesting: a review on designing methodologies and applications LG Tran, HK Cha, WT Park Micro and Nano Systems Letters 5, 1-16, 2017	338	2017
Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators RN Candler, MA Hopcroft, B Kim, WT Park, R Melamud, M Agarwal, ... Journal of Microelectromechanical Systems 15 (6), 1446-1456, 2006	250	2006
Method of Fabricating High Aspect Ratio Transducer Using Metal Compression Bonding WT Park, H Loreck, L Karlin US Patent App. 12/363,916, 2010	248	2010
Single wafer encapsulation of MEMS devices RN Candler, WT Park, H Li, G Yama, A Partridge, M Lutz, TW Kenny IEEE transactions on advanced packaging 26 (3), 227-232, 2003	234	2003
Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators B Kim, RN Candler, MA Hopcroft, M Agarwal, WT Park, TW Kenny Sensors and Actuators A: Physical 136 (1), 125-131, 2007	186	2007
Impact of geometry on thermoelastic dissipation in micromechanical resonant beams RN Candler, A Duwel, M Varghese, SA Chandorkar, MA Hopcroft, ... Journal of Microelectromechanical Systems 15 (4), 927-934, 2006	175	2006
A CMOS Rectifier With a Cross-Coupled Latched Comparator for Wireless Power Transfer in Biomedical Applications HK Cha, WT Park, M Je IEEE, 2012	172	2012
Vertically integrated MEMS sensor device with multi-stimulus sensing TF Miller, Y Lin, DJ Monk, WT Park US Patent 8,220,330, 2012	100	2012
Gate-all-around junctionless nanowire MOSFET with improved low-frequency noise behavior P Singh, N Singh, J Miao, WT Park, DL Kwong IEEE electron device letters 32 (12), 1752-1754, 2011	100	2011
Measurement system for low force and small displacement contacts BL Pruitt, WT Park, TW Kenny Journal of Microelectromechanical Systems 13 (2), 220-229, 2004	96	2004
Laterally integrated MEMS sensor device with multi-stimulus sensing AC McNeil, Y Lin, WT Park US Patent 8,387,464, 2013	86	2013
Optimization of NEMS pressure sensors with a multilayered diaphragm using silicon nanowires as piezoresistive sensing elements L Lou, S Zhang, WT Park, JM Tsai, DL Kwong, C Lee Journal of Micromechanics and Microengineering 22 (5), 055012, 2012	85	2012
An inductively powered implantable blood flow sensor microsystem for vascular grafts JH Cheong, SSY Ng, X Liu, RF Xue, HJ Lim, PB Khannur, KL Chan, ... IEEE Transactions on Biomedical Engineering 59 (9), 2466-2475, 2012	80	2012
MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabricating Same Y Lin, ME Schlarmann, HD Desai, WT Park US Patent App. 12/861,509, 2012	77	2012
Investigation of energy loss mechanisms in micromechanical resonators RN Candler, H Li, M Lutz, WT Park, A Partridge, G Yama, TW Kenny TRANSDUCERS'03. 12th International Conference on Solid-State Sensors …, 2003	74	2003
Frequency stability of wafer-scale encapsulated MEMS resonators B Kim, RN Candler, M Hopcroft, M Agarwal, WT Park, TW Kenny The 13th International Conference on Solid-State Sensors, Actuators and …, 2005	70	2005
Vertically integrated MEMS acceleration transducer Y Lin, TF Miller, WT Park US Patent 8,186,221, 2012	61	2012
Encapsulated submillimeter piezoresistive accelerometers WT Park, A Partridge, RN Candler, V Ayanoor-Vitikkate, G Yama, M Lutz, ... Journal of Microelectromechanical Systems 15 (3), 507-514, 2006	53	2006

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