| Highly sensitive, flexible, and wearable pressure sensor based on a giant piezocapacitive effect of three-dimensional microporous elastomeric dielectric layer D Kwon, TI Lee, J Shim, S Ryu, MS Kim, S Kim, TS Kim, I Park ACS applied materials & interfaces 8 (26), 16922-16931, 2016 | 490 | 2016 |
| Wearable, ultrawide-range, and bending-insensitive pressure sensor based on carbon nanotube network-coated porous elastomer sponges for human interface and healthcare devices S Kim, M Amjadi, TI Lee, Y Jeong, D Kwon, MS Kim, K Kim, TS Kim, ... ACS applied materials & interfaces 11 (26), 23639-23648, 2019 | 181 | 2019 |
| Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit MB Khan, DH Kim, JH Han, H Saif, H Lee, Y Lee, M Kim, E Jang, SK Hong, ... Nano Energy 58, 211-219, 2019 | 108 | 2019 |
| Hydrogel-laden paper scaffold system for origami-based tissue engineering SH Kim, HR Lee, SJ Yu, ME Han, DY Lee, SY Kim, HJ Ahn, MJ Han, ... Proceedings of the National Academy of Sciences 112 (50), 15426-15431, 2015 | 105 | 2015 |
| Wireless powered wearable micro light-emitting diodes HE Lee, D Lee, TI Lee, JH Shin, GM Choi, C Kim, SH Lee, JH Lee, ... Nano Energy 55, 454-462, 2019 | 102 | 2019 |
| Extremely robust and patternable electrodes for copy-paper-based electronics J Ahn, JW Seo, TI Lee, D Kwon, I Park, TS Kim, JY Lee ACS applied materials & interfaces 8 (29), 19031-19037, 2016 | 52 | 2016 |
| Contact-free thermal expansion measurement of very soft elastomers using digital image correlation TI Lee, MS Kim, TS Kim Polymer Testing 51, 181-189, 2016 | 49 | 2016 |
| Bending properties of anisotropic conductive films assembled chip-in-flex packages for wearable electronics applications JH Kim, TI Lee, JW Shin, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 39 | 2016 |
| An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures Y Kim, Y Kim, TI Lee, TS Kim, S Ryu Composite Structures 189, 27-36, 2018 | 37 | 2018 |
| Thermal expansion behavior of thin films expanding freely on water surface JH Kim, KL Jang, K Ahn, T Yoon, TI Lee, TS Kim Scientific reports 9 (1), 7071, 2019 | 35 | 2019 |
| Direct graphene transfer and its application to transfer printing using mechanically controlled, large area graphene/copper freestanding layer J Seo, C Kim, BS Ma, TI Lee, JH Bong, JG Oh, BJ Cho, TS Kim Advanced Functional Materials 28 (26), 1707102, 2018 | 34 | 2018 |
| Flexural and tensile moduli of flexible FR4 substrates TI Lee, C Kim, MS Kim, TS Kim Polymer Testing 53, 70-76, 2016 | 32 | 2016 |
| Warpage analysis of electroplated Cu films on fiber-reinforced polymer packaging substrates C Kim, TI Lee, MS Kim, TS Kim polymers 7 (6), 985-1004, 2015 | 32 | 2015 |
| Direct visualization of cross-sectional strain distribution in flexible devices TI Lee, W Jo, W Kim, JH Kim, KW Paik, TS Kim ACS applied materials & interfaces 11 (14), 13416-13422, 2019 | 30 | 2019 |
| Porous dielectric elastomer based ultra-sensitive capacitive pressure sensor and its application to wearable sensing device D Kwon, TI Lee, MS Kim, S Kim, TS Kim, I Park 2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015 | 28 | 2015 |
| The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications JH Kim, TI Lee, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 26 | 2017 |
| Effects of the mechanical properties of polymer resin and the conductive ball types of anisotropic conductive films on the bending properties of chip-in-flex package YL Kim, TI Lee, JH Kim, W Kim, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 21 | 2016 |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations JB Pyo, TI Lee, C Kim, MS Kim, TS Kim Soft matter 12 (18), 4135-4141, 2016 | 19 | 2016 |
| Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics JW Seo, M Joo, J Ahn, TI Lee, TS Kim, SG Im, JY Lee Nanoscale 9 (10), 3399-3407, 2017 | 18 | 2017 |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing C Kim, TI Lee, MS Kim, TS Kim Microelectronics Reliability 73, 136-145, 2017 | 15 | 2017 |
