| Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface MJ Williamson, RM Tromp, PM Vereecken, R Hull, FM Ross Nature materials 2 (8), 532-536, 2003 | 865 | 2003 |
| Chemical vapour deposition of zeolitic imidazolate framework thin films I Stassen, M Styles, G Grenci, HV Gorp, W Vanderlinden, SD Feyter, ... Nature materials 15 (3), 304-310, 2016 | 627 | 2016 |
| The chemistry of additives in damascene copper plating PM Vereecken, RA Binstead, H Deligianni, PC Andricacos IBM Journal of Research and Development 49 (1), 3-18, 2005 | 582 | 2005 |
| Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data A Radisic, PM Vereecken, JB Hannon, PC Searson, FM Ross Nano Letters 6 (2), 238-242, 2006 | 304 | 2006 |
| Liner materials for direct electrodeposition of Cu MW Lane, CE Murray, FR McFeely, PM Vereecken, R Rosenberg Applied physics letters 83 (12), 2330-2332, 2003 | 233 | 2003 |
| Electrochemical Deposition of Copper on n‐Si/TiN G Oskam, PM Vereecken, PC Searson Journal of The Electrochemical Society 146 (4), 1436-1441, 1999 | 170 | 1999 |
| Solvent-free synthesis of supported ZIF-8 films and patterns through transformation of deposited zinc oxide precursors I Stassen, N Campagnol, J Fransaer, P Vereecken, D De Vos, R Ameloot CrystEngComm 15 (45), 9308-9311, 2013 | 160 | 2013 |
| Solvent-free synthesis of supported ZIF-8 films and patterns through transformation of deposited zinc oxide precursors I Stassen, N Campagnol, J Fransaer, P Vereecken, D De Vos, R Ameloot CrystEngComm 15 (45), 9308-9311, 2013 | 160 | 2013 |
| Particle codeposition in nanocomposite films PM Vereecken, I Shao, PC Searson Journal of the Electrochemical Society 147 (7), 2572, 2000 | 159 | 2000 |
| Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth F Iacopi, PM Vereecken, M Schaekers, M Caymax, N Moelans, ... Nanotechnology 18 (50), 505307, 2007 | 158 | 2007 |
| The morphology and nucleation kinetics of copper islands during electrodeposition A Radisic, PM Vereecken, PC Searson, FM Ross Surface science 600 (9), 1817-1826, 2006 | 153 | 2006 |
| Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects S Masahito, Y Kashiwagi, Y Li, K Arstila, O Richard, DJ Cott, M Heyns, ... Nanotechnology 22 (8), 085302, 2011 | 127 | 2011 |
| Towards metal–organic framework based field effect chemical sensors: UiO-66-NH 2 for nerve agent detection I Stassen, B Bueken, H Reinsch, JFM Oudenhoven, D Wouters, J Hajek, ... Chemical Science, 2016 | 124 | 2016 |
| Advances in 3D Thin‐Film Li‐Ion Batteries S Moitzheim, B Put, PM Vereecken Advanced Materials Interfaces, 1900805, 2019 | 114 | 2019 |
| Copper electrodeposition for nanofabrication of electronics devices K Kondo, RN Akolkar, DP Barkey, M Yokoi Springer, 2014 | 112 | 2014 |
| A USB-controlled potentiostat/galvanostat for thin-film battery characterization T Dobbelaere, PM Vereecken, C Detavernier HardwareX, 2017 | 109 | 2017 |
| Kinetics of particle codeposition of nanocomposites I Shao, PM Vereecken, RC Cammarata, PC Searson Journal of the Electrochemical Society 149 (11), C610, 2002 | 107 | 2002 |
| Selective capping of copper wiring PC Andricacos, ST Chen, JM Cotte, H Deligianni, M Krishnan, WT Tseng, ... US Patent 7,008,871, 2006 | 104 | 2006 |
| Synthesis and Characterization of Particle-reinforced Ni/Al2O3 Nanocomposites I Shao, PM Vereecken, CL Chien, PC Searson, RC Cammarata Journal of materials research 17 (6), 1412-1418, 2002 | 103 | 2002 |
| Copper plating for 3D interconnects A Radisic, O Lühn, J Vaes, S Armini, Z El-Mekki, D Radisic, W Ruythooren, ... ECS Transactions 25 (38), 119-125, 2010 | 99 | 2010 |
Peter SearsonReynolds Professor of Engineering, Johns Hopkins University在 jhu.edu 的电子邮件经过验证
