| Sparse signal representation and its applications in ultrasonic NDE GM Zhang, CZ Zhang, DM Harvey Ultrasonics 52 (3), 351-363, 2012 | 131 | 2012 |
| Microelectronic package characterisation using scanning acoustic microscopy GM Zhang, DM Harvey, DR Braden NDT & E International 40 (8), 609-617, 2007 | 64 | 2007 |
| Contemporary ultrasonic signal processing approaches for nondestructive evaluation of multilayered structures GM Zhang, DM Harvey Nondestructive testing and evaluation 27 (1), 1-27, 2012 | 59 | 2012 |
| A support vector machine approach for classification of welding defects from ultrasonic signals Y Chen, HW Ma, GM Zhang Nondestructive Testing and Evaluation 29 (3), 243-254, 2014 | 46 | 2014 |
| Signal denoising and ultrasonic flaw detection via overcomplete and sparse representations GM Zhang, DM Harvey, DR Braden The Journal of the Acoustical Society of America 124 (5), 2963-2972, 2008 | 36 | 2008 |
| Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages GM Zhang, DM Harvey, DR Braden IEEE transactions on advanced packaging 29 (2), 271-283, 2006 | 34 | 2006 |
| Infrared LEDs-based pose estimation with underground camera model for boom-type roadheader in coal mining W Yang, X Zhang, H Ma, GM Zhang Ieee Access 7, 33698-33712, 2019 | 29 | 2019 |
| An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation AL Qi, GM Zhang, M Dong, HW Ma, DM Harvey Ultrasonics 88, 1-8, 2018 | 24 | 2018 |
| Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages CS Lee, GM Zhang, DM Harvey, A Qi Ndt & E International 79, 1-6, 2016 | 24 | 2016 |
| Through lifetime monitoring of solder joints using acoustic micro imaging RSH Yang, DR Braden, GM Zhang, DM Harvey Soldering & Surface Mount Technology 24 (1), 30-37, 2012 | 23 | 2012 |
| Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection GM Zhang, DM Harvey, DR Braden Microelectronics Reliability 46 (5-6), 811-821, 2006 | 21 | 2006 |
| An automated ultrasonic inspection approach for flip chip solder joint assessment RSH Yang, DR Braden, GM Zhang, DM Harvey Microelectronics Reliability 52 (12), 2995-3001, 2012 | 20 | 2012 |
| Micro-nondestructive evaluation of microelectronics using three-dimensional acoustic imaging GM Zhang, DM Harvey, DR Burton Applied Physics Letters 98 (9), 2011 | 18 | 2011 |
| Geometrically driven underground camera modeling and calibration with coplanarity constraints for a boom-type roadheader W Yang, X Zhang, H Ma, GM Zhang IEEE Transactions on Industrial Electronics 68 (9), 8919-8929, 2020 | 17 | 2020 |
| Effect of sparse basis selection on ultrasonic signal representation GM Zhang, DM Harvey, DR Braden Ultrasonics 45 (1-4), 82-91, 2006 | 17 | 2006 |
| Laser beams-based localization methods for boom-type roadheader using underground camera non-uniform blur model W Yang, X Zhang, H Ma, G Zhang IEEE Access 8, 190327-190341, 2020 | 16 | 2020 |
| Modeling and machining of integral impeller based on NURBS curve J Wei, X Hou, G Xu, G Zhang, H Fan The International Journal of Advanced Manufacturing Technology 113, 2243-2255, 2021 | 15 | 2021 |
| An improved skewness decision tree svm algorithm for the classification of steel cord conveyor belt defects Q Mao, H Ma, X Zhang, G Zhang Applied sciences 8 (12), 2574, 2018 | 12 | 2018 |
| An improved acoustic microimaging technique with learning overcomplete representation GM Zhang, DM Harvey, DR Braden The Journal of the Acoustical Society of America 118 (6), 3706-3720, 2005 | 12 | 2005 |
| Failure patterns of solder joints identified through lifetime vibration tests K Baishya, DM Harvey, T Partida Manzanera, G Zhang, DR Braden Nondestructive Testing and Evaluation 38 (1), 147-171, 2023 | 11 | 2023 |
David Mark HarveyProfessor of Electronic Engineering, LJMU在 ljmu.ac.uk 的电子邮件经过验证
