| Investigations on nozzle geometry in fused filament fabrication V Nienhaus, K Smith, D Spiehl, E Dörsam Additive Manufacturing 28, 711-718, 2019 | 72 | 2019 |
| Characterization and inkjet printing of an RNA aptamer for paper-based biosensing of ciprofloxacin J Jaeger, F Groher, J Stamm, D Spiehl, J Braun, E Dörsam, B Suess Biosensors 9 (1), 7, 2019 | 35 | 2019 |
| Recovering camera sensitivities using target-based reflectances captured under multiple LED-illuminations P Urban, M Desch, K Happel, D Spiehl Proc. of Workshop on Color Image Processing, 9-16, 2010 | 33 | 2010 |
| Engineering of flexo-and gravure-printed indium–zinc-oxide semiconductor layers for high-performance thin-film transistors D Spiehl, M Häming, HM Sauer, K Bonrad, E Dörsam IEEE Transactions on Electron Devices 62 (9), 2871-2877, 2015 | 29 | 2015 |
| Combining wax printing with hot embossing for the design of geometrically well-defined microfluidic papers N Postulka, A Striegel, M Krauße, D Mager, D Spiehl, T Meckel, M Worgull, ... ACS applied materials & interfaces 11 (4), 4578-4587, 2018 | 27 | 2018 |
| Carbohydrate binding module-fused antibodies improve the performance of cellulose-based lateral flow immunoassays A Elter, T Bock, D Spiehl, G Russo, SC Hinz, S Bitsch, E Baum, ... Scientific reports 11 (1), 7880, 2021 | 23 | 2021 |
| Gravure printing for mesoporous film preparation N Herzog, R Brilmayer, M Stanzel, A Kalyta, D Spiehl, E Dörsam, C Hess, ... RSC advances 9 (41), 23570-23578, 2019 | 22 | 2019 |
| Analysis of free chlorine in aqueous solution at very low concentration with lateral flow tests KU Schwenke, D Spiehl, M Krauße, L Riedler, A Ruppenthal, K Villforth, ... Scientific reports 9 (1), 17212, 2019 | 21 | 2019 |
| Analysis of the mobility of printed organic p-channel transistors depending on the transistor geometry and orientation D Spiehl, S Pankalla, M Glesner, E Doersam Journal of Physics: Conference Series 345 (1), 012013, 2012 | 14 | 2012 |
| Flexographic printing of nanoparticulate tin-doped indium oxide inks on PET foils and glass substrates M Wegener, D Spiehl, HM Sauer, F Mikschl, X Liu, N Kölpin, M Schmidt, ... Journal of Materials Science 51, 4588-4600, 2016 | 12 | 2016 |
| Mass characterisation of organic transistors and Monte-Carlo circuit simulation S Pankalla, R Ganesan, D Spiehl, HM Sauer, E Dörsam, M Glesner Organic Electronics 14 (2), 676-681, 2013 | 12 | 2013 |
| Device for measuring part adhesion in FFF process D Laumann, D Spiehl, E Dörsam HardwareX 11, e00258, 2022 | 8 | 2022 |
| Comparing gloss meters for gloss measurements on metallic embellishments from the printing industry CF Weber, D Spiehl, E Dörsam Advances in Printing and Media Technology: Proceedings of the 47th …, 2021 | 8 | 2021 |
| A microwave molecular solution based approach towards high-κ-tantalum (v) oxide nanoparticles: synthesis, dielectric properties and electron paramagnetic resonance … RC Hoffmann, M Kaloumenos, D Spiehl, E Erdem, S Repp, S Weber, ... Physical Chemistry Chemical Physics 17 (47), 31801-31809, 2015 | 8 | 2015 |
| Interaction of printing speed and temperature settings on the build plate adhesion of 3D-printed polylactide acid parts D Laumann, D Spiehl, E Dörsam, A Blaeser The Journal of Adhesion 99 (7), 1186-1204, 2023 | 6 | 2023 |
| Electrical properties of solution processed multilayer high-k ZrO2 capacitors in inert atmosphere M Kaloumenos, K Hofmann, D Spiehl, R Hoffmann, R Precht, K Bonrad Thin Solid Films 600, 59-64, 2016 | 6 | 2016 |
| Comparing measurement principles of three gloss meters and using them for measuring gloss on metallic embellishments produced by the printing industry CF Weber, D Spiehl, E Dörsam Lux junior 15, 327-341, 2021 | 5 | 2021 |
| Using FEM simulation as a tool to develop pad printing A Al Aboud, E Dörsam, A Hakimi Tehrani, D Spiehl Advances in Printing and Media Technology: Proceedings of the 45th …, 2018 | 5 | 2018 |
| Elastic model of paper stacks by considering the paper structure J Chen, E Dörsam, D Spiehl, AH Tehrani Nordic Pulp & Paper Research Journal 31 (4), 648-658, 2016 | 5 | 2016 |
| Improved contact resistivity and intra-die variation in organic thin film transistors S Pankalla, D Spiehl, HM Sauer, E Dörsam, M Glesner Applied Physics Letters 102 (17), 2013 | 5 | 2013 |
Edgar DörsamProfessor, Technische Universität Darmstadt在 idd.tu-darmstadt.de 的电子邮件经过验证
