| Forced convection in a square cavity with inlet and outlet ports SM Saeidi, JM Khodadadi International Journal of Heat and Mass Transfer 49 (11-12), 1896-1906, 2006 | 149 | 2006 |
| HYBRID THERMAL INTERFACE MATERIAL FOR IC PACKAGES WITH INTEGRATED HEAT SPREADER SM Saeidi, SZ Zhao US Patent 9,041,192, 2015 | 93 | 2015 |
| Fast and accurate thermal modeling and optimization for monolithic 3D ICs SK Samal, S Panth, K Samadi, M Saedi, Y Du, SK Lim Proceedings of the 51st Annual Design Automation Conference, 1-6, 2014 | 73 | 2014 |
| Transient flow and heat transfer leading to periodic state in a cavity with inlet and outlet ports due to incoming flow oscillation SM Saeidi, JM Khodadadi International Journal of Heat and Mass Transfer 50 (3-4), 530-538, 2007 | 52 | 2007 |
| Fabrication, characterization, and computational modeling of a piezoelectrically actuated microvalve for liquid flow control C Lee, EH Yang, SM Saeidi, JM Khodadadi Journal of microelectromechanical systems 15 (3), 686-696, 2006 | 43 | 2006 |
| Dynamic and fast local hotspot search and real time temperature monitoring M Keskin, M Roham, M Saeidi, A Derbyshire, R Gilmore, L Chua-Eoan US Patent App. 15/263,101, 2018 | 41 | 2018 |
| Adaptive regression-based thermal modeling and optimization for monolithic 3-D ICs SK Samal, S Panth, K Samadi, M Saeidi, Y Du, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2016 | 34 | 2016 |
| Package-on-package (PoP) device comprising bi-directional thermal electric cooler R Mittal, HJ Park, P Wang, M Saeidi, A Mittal US Patent 9,746,889, 2017 | 29 | 2017 |
| Hybrid thermal interface material for IC packages with integrated heat spreader M Saeidi, SZ Zhao US Patent 9,472,485, 2016 | 23 | 2016 |
| Pressure drop predictions in microfibrous materials using computational fluid dynamics RK Duggirala, CJ Roy, SM Saeidi, JM Khodadadi, DR Cahela, ... | 21 | 2008 |
| Thermal solution for wearable devices by using wrist band as heat sink M Saeidi, E Rahim, R Mittal, A Mittal US Patent 9,652,005, 2017 | 13 | 2017 |
| Thermal implications of mobile 3D-ICs M Saeidi, K Samadi, A Mittal, R Mittal 2014 International 3D Systems Integration Conference (3DIC), 1-7, 2014 | 12 | 2014 |
| Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power R Mittal, M Saeidi, T Xue, RF Alton, R Chandra, S Dasnurkar US Patent 9,557,797, 2017 | 11 | 2017 |
| Heat transfer electromagnetic interference shield M Saeidi, E Rahim, R Mittal, A Mittal US Patent App. 14/957,569, 2017 | 10 | 2017 |
| Fast and accurate thermal analysis of smartphone with dynamic power management using reduced order modeling S Krishnaswamy, P Jain, M Saeidi, A Kulkarni, A Adhiya, J Harvest 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 10 | 2017 |
| Thermal management of electronic headsets E Rahim, M Saeidi, A Mittal, R Mittal US Patent App. 14/843,973, 2017 | 10 | 2017 |
| Thermal sensor placement for hotspot interpolation RM Coutts, R Mittal, M Saeidi, PI Penzes US Patent 10,401,235, 2019 | 9 | 2019 |
| Adaptive thermal control and power budget HJ Park, R Mittal, M Saeidi US Patent 9,983,557, 2018 | 9 | 2018 |
| Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion S Vivek, M Saeidi US Patent 10,649,503, 2020 | 8 | 2020 |
| DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUITS (ICs) FOR ESTIMATING TEMPERATURE WITHIN THE ICs, AND RELATED SYSTEMS AND METHODS K Samadi, Y Du, M Saeidi US Patent App. 14/091,390, 2015 | 8 | 2015 |
