| Robotic hands with intrinsic tactile sensing via 3D printed soft pressure sensors M Ntagios, H Nassar, A Pullanchiyodan, WT Navaraj, R Dahiya Advanced Intelligent Systems 2 (6), 1900080, 2020 | 123 | 2020 |
| Multi-Material 3D Printed Bendable Smart Sensing Structures H Nassar, M Ntagios, WT Navaraj, R Dahiva 2018 IEEE SENSORS, 1-4, 2018 | 45 | 2018 |
| Fused Deposition Modeling‐Based 3D‐Printed Electrical Interconnects and Circuits H Nassar, R Dahiya Advanced Intelligent Systems 3 (12), 2100102, 2021 | 35 | 2021 |
| 3D printed interdigitated capacitor based tilt sensor O Ozioko, H Nassar, R Dahiya IEEE Sensors Journal 21 (23), 26252-26260, 2021 | 32 | 2021 |
| Prosthetic Hand with Biomimetic Tactile Sensing and Force Feedback WT Navaraj, H Nassar, R Dahiya 2019 IEEE International Symposium on Circuits and Systems (ISCAS), 1-4, 2019 | 19 | 2019 |
| 3D Touch Surface for Interactive Pseudo‐Holographic Displays A Christou, Y Gao, WT Navaraj, H Nassar, R Dahiya Advanced Intelligent Systems, 2000126, 2020 | 16 | 2020 |
| 3D Printed Interconnects on Bendable Substrates for 3D Circuits H Nassar, A Pullanchiyodan, M Bhattacharjee, R Dahiya 2019 IEEE International Conference on Flexible and Printable Sensors and …, 2019 | 12 | 2019 |
| Fully 3D Printed Piezoelectric Pressure Sensor for Dynamic Tactile Sensing H Nassar, G Khandelwal, R Chirila, X Karagiorgis, RE Ginesi, AS Dahiya, ... Additive Manufacturing, 103601, 2023 | 8 | 2023 |
| Closed-loop direct ink extruder system with multi-part materials mixing M Ntagios, H Nassar, R Dahiya Additive Manufacturing 64, 103437, 2023 | 4 | 2023 |
| 3D Printed Capacitive Tilt Sensor O Ozioko, H Nassar, C Muir, R Dahiya 2020 IEEE International Conference on Flexible and Printable Sensors and …, 2020 | 3 | 2020 |
| 3D Printed Embedded Strain Sensor with Enhanced Performance H Nassar, R Dahiya The IEEE Int. Conf. on Flexible and Printable Sensors and Systems (FLEPS 2022), 2022 | 2 | 2022 |
| Tunable Conductive Composite for Printed Sensors and Embedded Circuits H Nassar, AS Dahiya, R Dahiya Advanced Intelligent Systems 5 (10), 2300075, 2023 | 1 | 2023 |
| Embedded Electronic Systems Via Multi-material Additive Manufacturing HYN Nassar University of Glasgow, 2022 | | 2022 |
Ravinder DahiyaProfessor, ECE Dept, Northeastern University, Boston, USA在 northeastern.edu 的电子邮件经过验证
