| A novel unified model for copper and MLGNR interconnects using voltage-and current-mode signaling schemes Y Agrawal, MG Kumar, R Chandel IEEE transactions on electromagnetic compatibility 59 (1), 217-227, 2016 | 47 | 2016 |
| Comprehensive model for high-speed current-mode signaling in next generation MWCNT bundle interconnect using FDTD technique Y Agrawal, MG Kumar, R Chandel IEEE Transactions on Nanotechnology 15 (4), 590-598, 2016 | 44 | 2016 |
| An efficient crosstalk model for coupled multiwalled carbon nanotube interconnects MG Kumar, R Chandel, Y Agrawal IEEE Transactions on Electromagnetic Compatibility 60 (2), 487-496, 2017 | 33 | 2017 |
| Carbon nanotube interconnects− a promising solution for VLSI circuits MG Kumar, Y Agrawal, R Chandel IETE Journal of Education 57 (2), 46-64, 2016 | 30 | 2016 |
| Modelling and performance analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects GK Mekala, Y Agrawal, R Chandel IET Circuits, Devices & Systems 11 (3), 232-240, 2017 | 27 | 2017 |
| Structure fortification of mixed CNT bundle interconnects for nano integrated circuits using constraint-based particle swarm optimization T Pathade, Y Agrawal, R Parekh, MG Kumar IEEE Transactions on Nanotechnology 20, 194-204, 2021 | 20 | 2021 |
| An efficient and novel FDTD method based performance investigation in high-speed current-mode signaling SWCNT bundle interconnect Y Agrawal, M Girish, R Chandel Sādhanā 43 (11), 175, 2018 | 10 | 2018 |
| A unified delay, power and crosstalk model for current mode signaling multiwall carbon nanotube interconnects Y Agrawal, MG Kumar, R Chandel Circuits, Systems, and Signal Processing 37 (4), 1359-1382, 2018 | 9 | 2018 |
| A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects MG Kumar, Y Agrawal, VR Kumar, R Chandel Microelectronics Journal 118, 105294, 2021 | 7 | 2021 |
| Krill Herd Algorithm for solution of economic dispatch with valve-point loading effect H Pulluri, N Goutham Kumar, U Mohan Rao, Preeti, MG Kumar Applications of Computing, Automation and Wireless Systems in Electrical …, 2019 | 7 | 2019 |
| Timing and stability analysis of carbon nanotube interconnects MG Kumar, R Chandel, Y Agrawal 2015 IEEE International Symposium on Nanoelectronic and Information Systems …, 2015 | 6 | 2015 |
| Impact of temperature on structure deformation for monolithic inter-tier vias in monolithic 3D IC packaging system G Deepthi, MG Kumar, M Tatineni ECS Journal of Solid State Science and Technology 10 (11), 111002, 2021 | 3 | 2021 |
| Variability analysis of on-chip graphene interconnects at subthreshold regime N Patel, Y Agrawal, R Parekh, MG Kumar 2020 IEEE International Students' Conference on Electrical, Electronics and …, 2020 | 3 | 2020 |
| Transient and crosstalk analysis of doped and dielectric inserted MLGNR interconnects H Yeleti, MG Kumar, R Chandel, Y Agrawal 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2018 | 3 | 2018 |
| Performance analysis of multilayer graphene nano-ribbon in current-mode signaling interconnect system Y Agrawal, R Chandel, MG Kumar 2015 IEEE International Symposium on Nanoelectronic and Information Systems …, 2015 | 3 | 2015 |
| Performance analysis of mixed-wall CNT interconnects using colliding bodies optimization technique GK Mekala, Y Agrawal, R Chandel, A Kumar Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET), 189-211, 2020 | 2 | 2020 |
| Time-domain analytical modeling of current-mode signaling bundled single-wall carbon nanotube interconnects Y Agrawal, M Girish, R Chandel Proceedings of 2nd International Conference on Intelligent Computing and …, 2017 | 2 | 2017 |
| Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit G Bhatti, T Pathade, Y Agrawal, V Palaparthy, B Gohel, R Parekh, ... IETE Journal of Research, 1-16, 2023 | 1 | 2023 |
| Process variations in dielectric inserted side contact multilayer graphene nanoribbon interconnects using montecarlo simulations MG Kumar, Y Agrawal, VR Kumar 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 252-255, 2022 | 1 | 2022 |
| CNTFET Based Low Power Repeaters for On-Chip Interconnect System T Pathade, Y Agrawal, R Parekh, MG Kumar 2021 25th International Symposium on VLSI Design and Test (VDAT), 1-4, 2021 | 1 | 2021 |
