| Ab initio study of sodium intercalation into disordered carbon P Tsai, SC Chung, S Lin, A Yamada Journal of Materials Chemistry A 3 (18), 9763-9768, 2015 | 240 | 2015 |
| Phase diagrams of Pb-free solders and their related materials systems KN Subramanian, SW Chen, CH Wang, SK Lin, CN Chiu Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 149 | 2007 |
| Nano-volcanic eruption of silver S Lin, S Nagao, E Yokoi, C Oh, H Zhang, Y Liu, S Lin, K Suganuma Scientific reports 6 (1), 34769, 2016 | 88 | 2016 |
| Atomistic structure and ab initio electrochemical properties of Li4Ti5O12 defect spinel for Li ion batteries P Tsai, WD Hsu, S Lin Journal of The Electrochemical Society 161 (3), A439, 2014 | 84 | 2014 |
| Low temperature sintering of fully inorganic all-solid-state batteries–Impact of interfaces on full cell performance M Ihrig, M Finsterbusch, CL Tsai, AM Laptev, C Tu, M Bram, YJ Sohn, ... Journal of Power Sources 482, 228905, 2021 | 77 | 2021 |
| Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology YA Shen, S Zhou, J Li, C Yang, S Huang, S Lin, H Nishikawa Materials & design 183, 108144, 2019 | 73 | 2019 |
| Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples S Lin, C Cho, H Chang Journal of electronic materials 43, 204-211, 2014 | 67 | 2014 |
| Effective suppression of interfacial intermetallic compound growth between Sn–58 wt.% Bi solders and Cu substrates by minor Ga addition S Lin, TL Nguyen, S Wu, Y Wang Journal of Alloys and Compounds 586, 319-327, 2014 | 65 | 2014 |
| The electromigration effect revisited: Non-uniform local tensile stress-driven diffusion S Lin, Y Liu, SJ Chiu, YT Liu, HY Lee Scientific reports 7 (1), 3082, 2017 | 57 | 2017 |
| Thermodynamic description of the Cu–Sn system W Gierlotka, S Chen, S Lin Journal of Materials Research 22 (11), 3158-3165, 2007 | 52 | 2007 |
| Consideration of kinetics on intermetallics formation in solid-solution high entropy alloys TH Chou, JC Huang, CH Yang, SK Lin, TG Nieh Acta Materialia 195, 71-80, 2020 | 51 | 2020 |
| Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy S Zhou, C Yang, S Lin, AN AlHazaa, O Mokhtari, X Liu, H Nishikawa Materials Science and Engineering: A 744, 560-569, 2019 | 50 | 2019 |
| The mechanism of the sodiation and desodiation in Super P carbon electrode for sodium-ion battery CM Wu, PI Pan, YW Cheng, CP Liu, CC Chang, M Avdeev, S Lin Journal of Power Sources 340, 14-21, 2017 | 48 | 2017 |
| Phase equilibria of Sn–Sb–Cu system S Chen, A Zi, W Gierlotka, C Yang, C Wang, S Lin, C Hsu Materials Chemistry and Physics 132 (2-3), 703-715, 2012 | 48 | 2012 |
| Study of LiCoO2/Li7La3Zr2O12:Ta Interface Degradation in All-Solid-State Lithium Batteries M Ihrig, M Finsterbusch, AM Laptev, C Tu, NTT Tran, CA Lin, LY Kuo, ... ACS applied materials & interfaces 14 (9), 11288-11299, 2022 | 44 | 2022 |
| Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging S Lin, Y Yorikado, J Jiang, KS Kim, K Suganuma, S Chen, M Tsujimoto, ... Journal of materials research 22 (7), 1975-1986, 2007 | 43 | 2007 |
| Ab initio phase stability and electronic conductivity of the doped-Li4Ti5O12 anode for Li-ion batteries P Tsai, RN Nasara, Y Shen, C Liang, Y Chang, WD Hsu, NTT Tran, S Lin Acta Materialia 175, 196-205, 2019 | 41 | 2019 |
| Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In Y Hirata, C Yang, S Lin, H Nishikawa Materials Science and Engineering: A 813, 141131, 2021 | 39 | 2021 |
| One‐Step Synthesis of Highly Oxygen‐Deficient Lithium Titanate Oxide with Conformal Amorphous Carbon Coating as Anode Material for Lithium Ion Batteries RN Nasara, P Tsai, S Lin Advanced Materials Interfaces 4 (15), 1700329, 2017 | 39 | 2017 |
| Geometric and electronic properties of edge-decorated graphene nanoribbons SL Chang, SY Lin, SK Lin, CH Lee, MF Lin Scientific reports 4 (1), 6038, 2014 | 38 | 2014 |
Sinn-wen ChenNational Tsing Hua University在 mx.nthu.edu.tw 的电子邮件经过验证
