| Fluxless laser reflow bumping of Sn-Pb eutectic solder JH Lee, YH Lee, YS Kim Scripta materialia 42 (8), 789-793, 2000 | 81 | 2000 |
| Synthesis of tin nanoparticles through modified polyol process and effects of centrifuging and drying on nanoparticles C Sang-Soo, LEE Jong-Hyun Transactions of Nonferrous Metals Society of China 22, s707-s711, 2012 | 21 | 2012 |
| Die sinter bonding in air using copper formate preform for formation of full-density bondline LEE Yun-Ju, LEE Jong-Hyun Transactions of Nonferrous Metals Society of China 31 (6), 1717-1728, 2021 | 7 | 2021 |
| Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material LEE Jun-Sik, KIM Jun-Ki, KIM Mok-Soon, K Namhyun, LEE Jong-Hyun Transactions of Nonferrous Metals Society of China 21, s175-s181, 2011 | 4 | 2011 |
| Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering L Jong-Hyun, K Yong-Seog Journal of Electronic Materials 31 (6), 576, 2002 | 3 | 2002 |
| Rapid pressure-assisted sinter bonding in air using 200 nm Cu particles and enhancement of bonding strength by successive pressureless annealing MI KIM, LEE Jong-Hyun Transactions of Nonferrous Metals Society of China 32 (2), 629-638, 2022 | 1 | 2022 |
