| Glass fibres reinforced acrylic thermoplastic resin-based tri-block copolymers composites: Low velocity impact response at various temperatures RM Boumbimba, M Coulibaly, A Khabouchi, G Kinvi-Dossou, N Bonfoh, ... Composite Structures 160, 939-951, 2017 | 121 | 2017 |
| Innovative acrylic thermoplastic composites versus conventional composites: Improving the impact performances G Kinvi-Dossou, RM Boumbimba, N Bonfoh, S Garzon-Hernandez, ... Composite Structures 217, 1-13, 2019 | 93 | 2019 |
| A numerical homogenization of E-glass/acrylic woven composite laminates: Application to low velocity impact G Kinvi-Dossou, RM Boumbimba, N Bonfoh, Y Koutsawa, D Eccli, ... Composite Structures 200, 540-554, 2018 | 61 | 2018 |
| Micromechanical modeling of the anisotropic thermal conductivity of ellipsoidal inclusion-reinforced composite materials with weakly conducting interfaces N Bonfoh, C Dreistadt, H Sabar International Journal of Heat and Mass Transfer 108, 1727-1739, 2017 | 45 | 2017 |
| Micromechanical modeling of ductile damage of polycrystalline materials with heterogeneous particles N Bonfoh, P Lipinski, A Carmasol, S Tiem International Journal of Plasticity 20 (1), 85-106, 2004 | 35 | 2004 |
| Modeling of intra-crystalline hardening of materials with particles N Bonfoh, A Carmasol, P Lipinski International Journal of Plasticity 19 (8), 1167-1193, 2003 | 34 | 2003 |
| New micromechanical approach of the coated inclusion problem: Exact solution and applications N Bonfoh, V Hounkpati, H Sabar Computational materials science 62, 175-183, 2012 | 32 | 2012 |
| Modeling of bone adaptative behavior based on cells activities N Bonfoh, E Novinyo, P Lipinski Biomechanics and modeling in mechanobiology 10, 789-798, 2011 | 32 | 2011 |
| Anisotropic thermal conductivity of composites with ellipsoidal inclusions and highly conducting interfaces N Bonfoh, H Sabar International Journal of Heat and Mass Transfer 118, 498-509, 2018 | 31 | 2018 |
| Multi-site micromechanical modelling of thermo-elastic properties of heterogeneous materials W Kpobie, SB Khlifa, N Bonfoh, M Fendler, P Lipinski Composite Structures 94 (6), 2068-2077, 2012 | 30 | 2012 |
| Analytical modeling of multilayered dynamic sandwich composites embedded with auxetic layers WL Azoti, Y Koutsawa, N Bonfoh, P Lipinski, S Belouettar Engineering structures 57, 248-253, 2013 | 25 | 2013 |
| Ductile damage micromodeling by particles’ debonding in metal matrix composites N Bonfoh, P Lipinski International journal of mechanical sciences 49 (2), 151-160, 2007 | 22 | 2007 |
| Effective properties of elastic composite materials with multi-coated reinforcements: A new micromechanical modelling and applications N Bonfoh, M Coulibaly, H Sabar Composite Structures 115, 111-119, 2014 | 19 | 2014 |
| Influence of auxeticity of reinforcements on the overall properties of viscoelastic composite materials WL Azoti, N Bonfoh, Y Koutsawa, S Belouettar, P Lipinski Mechanics of Materials 61, 28-38, 2013 | 16 | 2013 |
| On the capability of micromechanics models to capture the auxetic behavior of fibers/particles reinforced composite materials WL Azoti, Y Koutsawa, N Bonfoh, P Lipinski, S Belouettar Composite structures 94 (1), 156-165, 2011 | 15 | 2011 |
| A mesoscale modelling approach of glass fibre/Elium acrylic woven laminates for low velocity impact simulation G Kinvi-Dossou, N Bonfoh, RM Boumbimba, Y Koutsawa, F Lachaud, ... Composite Structures 252, 112671, 2020 | 13 | 2020 |
| New exact multi-coated ellipsoidal inclusion model for anisotropic thermal conductivity of composite materials N Bonfoh, F Dinzart, H Sabar Applied Mathematical Modelling 87, 584-605, 2020 | 12 | 2020 |
| Effective thermal conductivity of composite ellipsoid assemblages with weakly conducting interfaces N Bonfoh, A Jeancolas, F Dinzart, H Sabar, M Mihaluta Composite Structures 202, 603-614, 2018 | 10 | 2018 |
| Exact solution of Eshelby's inhomogeneity problem in strain gradient theory of elasticity and its applications in composite materials N Bonfoh, H Sabar Applied Mathematical Modelling 117, 1-26, 2023 | 8 | 2023 |
| Three-Dimensional thermomechanical simulation of fine-pitch high-count ball grid array flip-chip assemblies W Kpobie, N Bonfoh, C Dreistadt, M Fendler, P Lipinski Journal of electronic materials 43, 671-684, 2014 | 6 | 2014 |
