受强制性开放获取政策约束的文章 - Jingwei Xian了解详情
无法在其他位置公开访问的文章：11 篇
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay
Acta Materialia 126, 540-551, 2017
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay
Acta Materialia 123, 404-415, 2017
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay
Intermetallics 91, 50-64, 2017
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Nucleation and growth crystallography of Al8Mn5 on B2-Al (Mn, Fe) in AZ91 magnesium alloys
G Zeng, JW Xian, CM Gourlay
Acta Materialia 153, 364-376, 2018
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-xBi/Cu joints
SA Belyakov, JW Xian, K Sweatman, T Nishimura, T Akaiwa, CM Gourlay
Journal of Alloys and Compounds 701, 321-334, 2017
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder
Y Xu, T Gu, J Xian, F Giuliani, TB Britton, CM Gourlay, FPE Dunne
International Journal of Plasticity 137, 102904, 2021
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ...
Intermetallics 102, 34-45, 2018
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys
JW Xian, L Peng, G Zeng, D Wang, CM Gourlay
Materialia 19, 101192, 2021
强制性开放获取政策： 国家自然科学基金委员会, UK Engineering and Physical Sciences Research Council
The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints
ZQ Li, SA Belyakov, JW Xian, CM Gourlay
Journal of Electronic Materials 47, 84-95, 2018
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Eutectic intermetallic formation during solidification of a Mg-Sn-Al-Zn-Mn alloy
Y Deng, G Zeng, J Xian, H Zhan, C Liu, CM Gourlay
Materials Characterization 186, 111807, 2022
强制性开放获取政策： 国家自然科学基金委员会, UK Engineering and Physical Sciences Research Council
Synchrotron radiography of Sn-0.7 Cu-0.05 Ni solder solidification
JW Xian, MAA Mohd Salleh, G Zeng, SA Belyakov, H Yasuda, K Nogita, ...
Solid State Phenomena 273, 66-71, 2018
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
可在其他位置公开访问的文章：22 篇
Nucleation and growth of tin in Pb-free solder joints
CM Gourlay, SA Belyakov, ZL Ma, JW Xian
Jom 67, 2383-2393, 2015
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7 (1), 40010, 2017
强制性开放获取政策： Australian Research Council, UK Engineering and Physical Sciences Research …
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle, CM Gourlay, FPE Dunne
International Journal of Plasticity 155, 103308, 2022
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds
ZL Ma, JW Xian, SA Belyakov, CM Gourlay
Acta Materialia 150, 281-294, 2018
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
Y Cui, JW Xian, A Zois, K Marquardt, H Yasuda, CM Gourlay
Acta Materialia 249, 118831, 2023
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SA Belyakov, J Xian, G Zeng, K Sweatman, T Nishimura, T Akaiwa, ...
Journal of Materials Science: Materials in Electronics 30, 378-390, 2019
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Controlling Bulk Cu6Sn5 Nucleation in Sn0. 7Cu/Cu Joints with Al Micro-alloying
JW Xian, SA Belyakov, CM Gourlay
Journal of Electronic Materials 45 (1), 69, 2016
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony
SA Belyakov, RJ Coyle, B Arfaei, JW Xian, CM Gourlay
Journal of Electronic Materials 50, 825-841, 2021
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints
JW Xian, SA Belyakov, CM Gourlay
Journal of Electronic Materials 50, 786-795, 2021
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
出版信息和资助信息由计算机程序自动确定