| Effect of aluminum on microstructure and property of Cu–Ni–Si alloys Q Lei, Z Li, C Dai, J Wang, X Chen, JM Xie, WW Yang, DL Chen Materials Science and Engineering: A 572, 65-74, 2013 | 772 | 2013 |
| The evolution of microstructure in Cu–8.0 Ni–1.8 Si–0.15 Mg alloy during aging Q Lei, Z Li, MP Wang, L Zhang, Z Xiao, YL Jia Materials Science and Engineering: A 527 (24-25), 6728-6733, 2010 | 689 | 2010 |
| Phase transformation behaviors and properties of a high strength Cu-Ni-Si alloy Q Lei, Z Xiao, W Hu, B Derby, Z Li Materials Science and Engineering: A 697, 37-47, 2017 | 180 | 2017 |
| A new ultrahigh strength Cu–Ni–Si alloy Q Lei, Z Li, T Xiao, Y Pang, ZQ Xiang, WT Qiu, Z Xiao Intermetallics 42, 77-84, 2013 | 158 | 2013 |
| Causes analysis on cracks in nickel-based single crystal superalloy fabricated by laser powder deposition additive manufacturing Z Zhou, L Huang, Y Shang, Y Li, L Jiang, Q Lei Materials & Design 160, 1238-1249, 2018 | 142 | 2018 |
| Microstructure and mechanical properties of a high strength Cu-Ni-Si alloy treated by combined aging processes Q Lei, Z Li, Y Gao, X Peng, B Derby Journal of Alloys and Compounds 695, 2413-2423, 2017 | 123 | 2017 |
| The microstructure evolution and properties of a Cu–Cr–Ag alloy during thermal-mechanical treatment Y Liu, Z Li, Y Jiang, Y Zhang, Z Zhou, Q Lei Journal of Materials Research 32 (7), 1324-1332, 2017 | 114 | 2017 |
| Effects of minor rare earths on the microstructure and properties of Cu-Cr-Zr alloy W Wang, J Zhu, N Qin, Y Zhang, S Li, Z Xiao, Q Lei, Z Li Journal of Alloys and Compounds 847, 155762, 2020 | 99 | 2020 |
| Microstructure and properties of a Cu–Ni–Si–Co–Cr alloy with high strength and high conductivity Z Zhao, Z Xiao, Z Li, W Qiu, H Jiang, Q Lei, Z Liu, Y Jiang, S Zhang Materials Science and Engineering: A 759, 396-403, 2019 | 99 | 2019 |
| Microstructure and mechanical properties of high product of strength and elongation Al-Zn-Mg-Cu-Zr alloys fabricated by spray deposition B Liu, Q Lei, L Xie, M Wang, Z Li Materials & Design 96, 217-223, 2016 | 97 | 2016 |
| Microstructure and properties of a novel Cu-Mg-Ca alloy with high strength and high electrical conductivity Y Li, Z Xiao, Z Li, Z Zhou, Z Yang, Q Lei Journal of Alloys and Compounds 723, 1162-1170, 2017 | 78 | 2017 |
| The transformation behavior of Cu–8.0 Ni–1.8 Si–0.6 Sn–0.15 Mg alloy during isothermal heat treatment Q Lei, Z Li, A Zhu, W Qiu, S Liang Materials characterization 62 (9), 904-911, 2011 | 76 | 2011 |
| Regulating twin boundary mobility by annealing in magnesium and its alloys Y Cui, Y Li, Z Wang, Q Lei, Y Koizumi, A Chiba International Journal of Plasticity 99, 1-18, 2017 | 75 | 2017 |
| Structural refinement and nanomechanical response of laser remelted Al-Al2Cu lamellar eutectic Q Lei, BP Ramakrishnan, S Wang, Y Wang, J Mazumder, A Misra Materials Science and Engineering: A 706, 115-125, 2017 | 70 | 2017 |
| Microstructural evolution, phase transition, and physics properties of a high strength Cu–Ni–Si–Al alloy Q Lei, S Li, J Zhu, Z Xiao, F Zhang, Z Li Materials Characterization 147, 315-323, 2019 | 69 | 2019 |
| Phase transformations behavior in a Cu–8.0 Ni–1.8 Si alloy Q Lei, Z Li, MP Wang, L Zhang, S Gong, Z Xiao, ZY Pan Journal of alloys and compounds 509 (8), 3617-3622, 2011 | 68 | 2011 |
| Microstructure evolution and deformation behaviour of Cu-10 wt% Fe alloy during cold rolling M Wang, Y Jiang, Z Li, Z Xiao, S Gong, W Qiu, Q Lei Materials Science and Engineering: A 801, 140379, 2021 | 67 | 2021 |
| Hot deformation behavior of Cu–8.0 Ni–1.8 Si–0.15 Mg alloy L Zhang, Z Li, Q Lei, WT Qiu, HT Luo Materials Science and Engineering: A 528 (3), 1641-1647, 2011 | 64 | 2011 |
| Microstructure and tensile properties of large-size 7055 aluminum billets fabricated by spray forming rapid solidification technology H Yu, M Wang, X Sheng, Z Li, L Chen, Q Lei, C Chen, Y Jia, Z Xiao, ... Journal of alloys and compounds 578, 208-214, 2013 | 62 | 2013 |
| Microstructure and mechanical properties of a Cu-Fe-Nb alloy with a high product of the strength times the elongation P Zhang, Q Lei, X Yuan, X Sheng, D Jiang, Y Li, Z Li Materials Today Communications 25, 101353, 2020 | 56 | 2020 |
Amit MisraUniversity of Michigan在 umich.edu 的电子邮件经过验证
