| Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy BL Silva, G Reinhart, H Nguyen-Thi, N Mangelinck-Noël, A Garcia, ... Materials Characterization 107, 43-53, 2015 | 73 | 2015 |
| Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys BL Silva, A Garcia, JE Spinelli Journal of Alloys and Compounds 691, 600-605, 2017 | 58 | 2017 |
| The effects of microstructure and intermetallic phases of directionally solidified Al–Fe alloys on microhardness BL Silva, A Garcia, JE Spinelli Materials Letters 89, 291-295, 2012 | 57 | 2012 |
| Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys BL Silva, MGC Xavier, A Garcia, JE Spinelli Materials Science and Engineering: A 705, 325-334, 2017 | 56 | 2017 |
| Thermal parameters, microstructure, and mechanical properties of directionally solidified Sn-0.7 wt.% Cu solder alloys containing 0 ppm to 1000 ppm Ni BL Silva, N Cheung, A Garcia, JE Spinelli Journal of electronic materials 42, 179-191, 2013 | 53 | 2013 |
| Sn–0.7 wt% Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient BL Silva, N Cheung, A Garcia, JE Spinelli Journal of Alloys and Compounds 632, 274-285, 2015 | 51 | 2015 |
| Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications JE Spinelli, BL Silva, A Garcia Materials & design 58, 482-490, 2014 | 47 | 2014 |
| Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7 wt% Cu–(0–0.1 wt% Ni) solder alloys BL Silva, N Cheung, A Garcia, JE Spinelli Materials Letters 142, 163-167, 2015 | 44 | 2015 |
| Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu, Ag) solder alloys BL Silva, A Garcia, JE Spinelli Materials Characterization 114, 30-42, 2016 | 43 | 2016 |
| Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys BL Silva, VCE da Silva, A Garcia, JE Spinelli Journal of electronic materials 46, 1754-1769, 2017 | 38 | 2017 |
| Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys JE Spinelli, BL Silva, A Garcia Journal of electronic materials 43, 1347-1361, 2014 | 36 | 2014 |
| A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys M Dias, TA Costa, BL Silva, JE Spinelli, N Cheung, A Garcia Microelectronics reliability 81, 150-158, 2018 | 28 | 2018 |
| The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys JE Spinelli, BL Silva, N Cheung, A Garcia Materials characterization 96, 115-125, 2014 | 27 | 2014 |
| Dendritic growth, solidification thermal parameters, and Mg content affecting the tensile properties of Al-Mg-1.5 wt pct Fe alloys LF Gomes, BL Silva, A Garcia, JE Spinelli Metallurgical and Materials Transactions A 48 (4), 1841-1855, 2017 | 26 | 2017 |
| Correlation between dendrite arm spacing and microhardness during unsteady-state directional solidification of Al–Ni alloys BL Silva, IJC Araujo, WS Silva, PR Goulart, A Garcia, JE Spinelli Philosophical magazine letters 91 (5), 337-343, 2011 | 26 | 2011 |
| An alternative thermal approach to evaluate the wettability of solder alloys WLR Santos, BL Silva, F Bertelli, JE Spinelli, N Cheung, A Garcia Applied thermal engineering 107, 431-440, 2016 | 23 | 2016 |
| The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy LS Ramos, RV Reyes, LF Gomes, A Garcia, JE Spinelli, BL Silva Materials Science and Engineering: A 776, 138959, 2020 | 20 | 2020 |
| Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys BL Silva, F Bertelli, MV Canté, JE Spinelli, N Cheung, A Garcia Journal of Materials Science: Materials in Electronics, 1-10, 2016 | 20 | 2016 |
| Directional solidification of a Sn-0.2 Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and … MGC Xavier, CB Cruz, R Kakitani, BL Silva, A Garcia, N Cheung, ... Journal of Alloys and Compounds 723, 1039-1052, 2017 | 19 | 2017 |
| Evolution of eutectic spacing during unidirectional solidification of Al-Ni alloys IJC Araujo, BL Silva, JE Spinelli, A Garcia Materials Research 14, 268-273, 2011 | 16 | 2011 |
José Eduardo SpinelliFederal University of São Carlos在 ufscar.br 的电子邮件经过验证
