| Convergence and validation in parapower: A design tool for phase change materials in electronics packaging M Deckard, P Shamberger, M Fish, M Berman, J Wang, L Boteler 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 27 | 2019 |
| Thin-film aerogel thermal conductivity measurements via 3ω ML Bauer, CM Bauer, MC Fish, RE Matthews, GT Garner, ... Journal of non-crystalline solids 357 (15), 2960-2965, 2011 | 26 | 2011 |
| Understanding trade-offs of phase change materials for transient thermal mitigation L Boteler, M Fish, M Berman, J Wang 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 19 | 2019 |
| Integrating heat sinks into a 3d co-design network model for quick parametric analysis LM Boteler, SM Miner, M Fish, M Berman 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 13 | 2019 |
| Thermal conductivity of power semiconductors—When does it matter? L Boteler, A Lelis, M Berman, M Fish 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2019 | 12 | 2019 |
| Compatibility Analysis of Liquid Gallium and Common Packaging Metals for Application in Electronic Component Thermal Management R McAfee, M Fish, D Baker, J Gess, L Boteler 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 8 | 2020 |
| System-level Pareto frontiers for on-chip thermoelectric coolers SU Yuruker, MC Fish, Z Yang, N Baldasaro, P Barletta, A Barcohen, ... Frontiers in Energy 12, 109-120, 2018 | 7 | 2018 |
| Thermal isolation within high-power 2.5 d heterogenously integrated electronic packages M Fish, P McCluskey, A Bar-Cohen 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1847-1855, 2016 | 7 | 2016 |
| Peak temperature mitigation of a multimicrochannel evaporator under transient heat loads C Anderson, J Richey, M Fish, T Bandhauer Journal of Electronic Packaging 143 (4), 041104, 2021 | 6 | 2021 |
| Analyzing the distribution of microencapsulated organic phase change materials embedded in a metallic matrix MK McCann, MC Fish, LM Boteler, DD Agonafer 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 6 | 2020 |
| Modeling thermal microspreading resistance in via arrays M Fish, P McCluskey, A Bar-Cohen Journal of Electronic Packaging 138 (1), 010909, 2016 | 5 | 2016 |
| Modeling Thermal Spreading Resistance in Via Arrays M Fish, P McCluskey, A Bar-Cohen International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 5 | 2015 |
| Zener Diode Reverse Breakdown Voltage as a Simultaneous Heating and Temperature Sensing Element R McAfee, M Fish, J Gess 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 3 | 2022 |
| Fabrication and Thermal Properties of a Gallium and Porous Foam Composite Phase Change Material RC McAfee, MC Fish, AA Wilson, HH Tsang, JA Boltersdorf, S Kim, ... ACS Applied Engineering Materials 1 (11), 2847-2857, 2023 | 2 | 2023 |
| Gallium Infiltration of Porous Metal Foams M Fish, A Wilson, B Hanrahan, C Pullen 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 2 | 2021 |
| Parametric and sensitivity analysis of power module design LM Boteler, MC Fish, MS Berman International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 2 | 2019 |
| Reducing thermal coupling using fluid cooled low-k interposers M Fish, P McCluskey, A Bar-Cohen 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 1-5, 2017 | 2 | 2017 |
| Phase change material behavior in finite thickness slabs under a step response heat M Deckard, DJ Sharar, M Fish, PJ Shamberger Journal of Electronic Packaging 145 (1), 011201, 2023 | 1 | 2023 |
| Toward High-Throughput Thermal Characterization of Combinatorial Thin-Film Solid State Phase Change Materials AA Wilson, DJ Sharar, JR Maddux, M Fish, I Kierzewski 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 1 | 2021 |
| Embedded Fluid Cooling of Close-Packed Via Arrays in Glass M Fish, B Martinis, P McCluskey, A Bar-Cohen 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 1 | 2018 |
