关注
MICHAEL FISH
MICHAEL FISH
Army Research Laboratory
在 virginia.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Convergence and validation in parapower: A design tool for phase change materials in electronics packaging
M Deckard, P Shamberger, M Fish, M Berman, J Wang, L Boteler
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
272019
Thin-film aerogel thermal conductivity measurements via 3ω
ML Bauer, CM Bauer, MC Fish, RE Matthews, GT Garner, ...
Journal of non-crystalline solids 357 (15), 2960-2965, 2011
262011
Understanding trade-offs of phase change materials for transient thermal mitigation
L Boteler, M Fish, M Berman, J Wang
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
192019
Integrating heat sinks into a 3d co-design network model for quick parametric analysis
LM Boteler, SM Miner, M Fish, M Berman
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
132019
Thermal conductivity of power semiconductors—When does it matter?
L Boteler, A Lelis, M Berman, M Fish
2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2019
122019
Compatibility Analysis of Liquid Gallium and Common Packaging Metals for Application in Electronic Component Thermal Management
R McAfee, M Fish, D Baker, J Gess, L Boteler
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
82020
System-level Pareto frontiers for on-chip thermoelectric coolers
SU Yuruker, MC Fish, Z Yang, N Baldasaro, P Barletta, A Barcohen, ...
Frontiers in Energy 12, 109-120, 2018
72018
Thermal isolation within high-power 2.5 d heterogenously integrated electronic packages
M Fish, P McCluskey, A Bar-Cohen
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1847-1855, 2016
72016
Peak temperature mitigation of a multimicrochannel evaporator under transient heat loads
C Anderson, J Richey, M Fish, T Bandhauer
Journal of Electronic Packaging 143 (4), 041104, 2021
62021
Analyzing the distribution of microencapsulated organic phase change materials embedded in a metallic matrix
MK McCann, MC Fish, LM Boteler, DD Agonafer
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
62020
Modeling thermal microspreading resistance in via arrays
M Fish, P McCluskey, A Bar-Cohen
Journal of Electronic Packaging 138 (1), 010909, 2016
52016
Modeling Thermal Spreading Resistance in Via Arrays
M Fish, P McCluskey, A Bar-Cohen
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
52015
Zener Diode Reverse Breakdown Voltage as a Simultaneous Heating and Temperature Sensing Element
R McAfee, M Fish, J Gess
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022
32022
Fabrication and Thermal Properties of a Gallium and Porous Foam Composite Phase Change Material
RC McAfee, MC Fish, AA Wilson, HH Tsang, JA Boltersdorf, S Kim, ...
ACS Applied Engineering Materials 1 (11), 2847-2857, 2023
22023
Gallium Infiltration of Porous Metal Foams
M Fish, A Wilson, B Hanrahan, C Pullen
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
22021
Parametric and sensitivity analysis of power module design
LM Boteler, MC Fish, MS Berman
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
22019
Reducing thermal coupling using fluid cooled low-k interposers
M Fish, P McCluskey, A Bar-Cohen
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 1-5, 2017
22017
Phase change material behavior in finite thickness slabs under a step response heat
M Deckard, DJ Sharar, M Fish, PJ Shamberger
Journal of Electronic Packaging 145 (1), 011201, 2023
12023
Toward High-Throughput Thermal Characterization of Combinatorial Thin-Film Solid State Phase Change Materials
AA Wilson, DJ Sharar, JR Maddux, M Fish, I Kierzewski
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
12021
Embedded Fluid Cooling of Close-Packed Via Arrays in Glass
M Fish, B Martinis, P McCluskey, A Bar-Cohen
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
12018
系统目前无法执行此操作,请稍后再试。
文章 1–20