| Development of a fast method for optimization of Au ball bond process J Gomes, M Mayer, B Lin Microelectronics Reliability 55 (3-4), 602-607, 2015 | 15 | 2015 |
| Accelerating reliability assessment with multi-oven racks and sensor chips for wire bonds M Mayer, J Gomes IMAPS New England Symposium, 2015 | 7 | 2015 |
| Effect of bond geometry on shear strength and HTS reliability for Au ball bond on Al pad J Gomes, M Mayer IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 6 | 2016 |
| Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization DE Xu, J Gomes, M Mayer, R Lyn, J Persic International Symposium on Microelectronics 2015 (1), 000298-000304, 2015 | 5 | 2015 |
| Effect of Au ball bond geometry on bond strength and process parameters, and assessing reliability on Al bond pad using integrated stress sensors J Gomes, M Mayer 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2127-2133, 2015 | 5 | 2015 |
| A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization J Gomes University of Waterloo, 2015 | 1 | 2015 |
