| Mini-review: Modeling and performance analysis of nanocarbon interconnects WS Zhao, K Fu, DW Wang, M Li, G Wang, WY Yin Applied Sciences 9 (11), 2174, 2019 | 40 | 2019 |
| Vertical graphene nanoribbon interconnects at the end of the roadmap WS Zhao, ZH Cheng, J Wang, K Fu, DW Wang, P Zhao, G Wang, L Dong IEEE Transactions on Electron Devices 65 (6), 2632-2637, 2018 | 37 | 2018 |
| An efficient surrogate assisted particle swarm optimization for antenna synthesis K Fu, X Cai, B Yuan, Y Yang, X Yao IEEE Transactions on Antennas and Propagation 70 (7), 4977-4984, 2022 | 26 | 2022 |
| Modeling of carbon nanotube-based differential through-silicon vias in 3-D ICs WS Zhao, QH Hu, K Fu, YY Zhang, DW Wang, J Wang, Y Hu, G Wang IEEE Transactions on Nanotechnology 19, 492-499, 2020 | 24 | 2020 |
| Modeling and performance analysis of shielded differential annular through-silicon via (SD-ATSV) for 3-D ICs K Fu, WS Zhao, G Wang, M Swaminathan IEEE Access 6, 33238-33250, 2018 | 14 | 2018 |
| Modeling and characterization of differential multibit carbon-nanotube through-silicon vias QH Hu, WS Zhao, K Fu, G Wang IEEE transactions on components, packaging and manufacturing technology 10 …, 2020 | 12 | 2020 |
| Analysis of Transmission Characteristics of Copper/Carbon Nanotube Composite Through‐Silicon Via Interconnects K Fu, J Zheng, WS Zhao, Y Hu, G Wang Chinese Journal of Electronics 28 (5), 920-924, 2019 | 12 | 2019 |
| A passive equalizer design for shielded differential through-silicon vias in 3-D IC K Fu, WS Zhao, G Wang, M Swaminathan IEEE Microwave and Wireless Components Letters 28 (9), 768-770, 2018 | 11 | 2018 |
| A compact passive equalizer design for differential channels in TSV-based 3-D ICs K Fu, WS Zhao, DW Wang, G Wang, M Swaminathan, WY Yin IEEE Access 6, 75278-75292, 2018 | 8 | 2018 |
| On the applicability of two‐bit carbon nanotube through‐silicon via for power distribution networks in 3‐D integrated circuits QH Hu, WS Zhao, K Fu, DW Wang, G Wang IET Circuits, Devices & Systems 15 (1), 20-26, 2021 | 4 | 2021 |
| An ultracompact Butterworth low-pass filter based on vertical spiral TSV inductor JW Pan, K Fu, WS Zhao, K Xu, L Dong, G Wang 2019 International Conference on Microwave and Millimeter Wave Technology …, 2019 | 4 | 2019 |
| Electrical modeling of carbon nanotube‐based shielded through‐silicon vias for three‐dimensional integrated circuits QH Hu, WS Zhao, K Fu, DW Wang, G Wang International Journal of Numerical Modelling: Electronic Networks, Devices …, 2021 | 3 | 2021 |
| A Passive Equalizer Design for On-Interposer Differential Interconnects in 2.5 D/3D ICs WS Zhao, K Fu, G Wang 2019 IEEE International Symposium on Radio-Frequency Integration Technology …, 2019 | 1 | 2019 |
| Modelling of crosstalk in differential through silicon vias for three‐dimensional integrated circuits JW Pan, K Fu, Q Liu, WS Zhao, L Dong, G Wang IET Microwaves, Antennas & Propagation 13 (10), 1529-1535, 2019 | 1 | 2019 |
| Modeling of crosstalk effects in carbon nanotube based differential through-silicon via array JW Pan, K Fu, ZH Cheng, WS Zhao, G Wang 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2017 | 1 | 2017 |
| The impact of current return path on the signal propagation in the through-silicon via array K Fu, JW Pan, J Jin, WS Zhao, G Wang 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2017 | | 2017 |
Madhavan SwaminathanDept Head EE; William E. Leonhard Endowed Chair; Director CHIMES (an SRC JUMP 2.0 Center) Penn State在 psu.edu 的电子邮件经过验证
