| A review on the mechanisms of ultrasonic wedge-wedge bonding Y Long, J Twiefel, J Wallaschek Journal of materials processing technology 245, 241-258, 2017 | 58 | 2017 |
| Effects of process parameters on force reduction and temperature variation during ultrasonic assisted incremental sheet forming process Y Long, Y Li, J Sun, I Ille, J Li, J Twiefel The International Journal of Advanced Manufacturing Technology 97, 13-24, 2018 | 44 | 2018 |
| Modeling and optimization of the molten salt cleaning process Y Long, J Li, DH Timmer, RE Jones, MA Gonzalez Journal of cleaner production 68, 243-251, 2014 | 38 | 2014 |
| Reliability-based performance optimization of tunnel boring machine considering geological uncertainties L Wang, W Sun, Y Long, X Yang Ieee Access 6, 19086-19098, 2018 | 34 | 2018 |
| Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation Y Long, B He, W Cui, Y Ji, X Zhuang, J Twiefel Materials & Design 192, 108718, 2020 | 27 | 2020 |
| Constitutive modeling and deformation analysis for the ultrasonic-assisted incremental forming process Y Li, Z Cheng, X Chen, Y Long, X Li, F Li, J Li, J Twiefel The International Journal of Advanced Manufacturing Technology 104, 2287-2299, 2019 | 26 | 2019 |
| Capability evaluation of ultrasonic cavitation peening at different standoff distances F Bai, KA Saalbach, Y Long, J Twiefel, J Wallaschek Ultrasonics 84, 38-44, 2018 | 25 | 2018 |
| Performance of CrCN-WS2 hard/soft composite coated tools in dry cutting of titanium alloys Y Lian, Y Long, G Zhao, C Mu, X Li, J Deng, C Xie Journal of Manufacturing Processes 54, 201-209, 2020 | 23 | 2020 |
| Design, preparation and cutting performance of bionic cutting tools based on head microstructures of dung beetle C You, G Zhao, X Chu, W Zhou, Y Long, Y Lian Journal of Manufacturing Processes 58, 129-135, 2020 | 22 | 2020 |
| Self-cleaning mechanisms in ultrasonic bonding of Al wire Y Long, F Dencker, A Isaak, J Hermsdorf, M Wurz, J Twiefel Journal of Materials Processing Technology 258, 58-66, 2018 | 20 | 2018 |
| Theoretical and experimental investigations of ultrasonic sound fields in thin bubbly liquid layers for ultrasonic cavitation peening F Bai, Y Long, KA Saalbach, J Twiefel Ultrasonics 93, 130-138, 2019 | 18 | 2019 |
| Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding Y Long, F Dencker, A Isaak, C Li, F Schneider, J Hermsdorf, M Wurz, ... Materials Science and Engineering: B 236, 189-196, 2018 | 11 | 2018 |
| Quantification of the energy flows during ultrasonic wire bonding under different process parameters Y Long, F Schneider, C Li, J Hermsdorf, J Twiefel, J Wallaschek International Journal of Precision Engineering and Manufacturing-Green …, 2019 | 9 | 2019 |
| Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process Y Long, F Dencker, F Schneider, B Emde, C Li, J Hermsdorf, M Wurz, ... 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 405-410, 2016 | 9 | 2016 |
| Experimental Investigation of the Rapid Fabrication of Micron and Submicron Structures on Polymers Utilizing Ultrasonic Assisted Embossing Y Zhu, S Bengsch, L Zheng, Y Long, BW Roth, MC Wurz, J Twiefel, ... Polymers 13 (15), 2417, 2021 | 8 | 2021 |
| A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process Y Long, F Dencker, M Wurz, A Feldhoff, J Twiefel International Symposium on Microelectronics 2016 (1), 000427-000432, 2016 | 7 | 2016 |
| Impacts of ultrasound on oxide removal–An attempt towards acid-free cleaning Y Long, F Bai, Y Zhang, KA Saalbach, J Twiefel Ultrasonics Sonochemistry 57, 1-11, 2019 | 6 | 2019 |
| Real-time observation of interface relative motion during ultrasonic wedge-wedge bonding process Y Long, J Twiefel, J Roth, J Wallaschek International symposium on microelectronics 2015 (1), 000419-000424, 2015 | 6 | 2015 |
| Influence of microscale tin particles on mechanical properties of silver sintering joints with reduced processing parameters S Hadeler, Y Long, R Ottermann, F Dencker, J Twiefel, MC Wurz 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 676-681, 2023 | 5 | 2023 |
| Contact mechanics and friction processes in ultrasonic wire bonding-Basic theories and experimental investigations Y Long, J Twiefel, J Wallaschek Journal of Sound and Vibration 468, 115021, 2020 | 5 | 2020 |
Jens TwiefelLeibniz Universität Hannover, Institute of Dynamics and Vibration Research在 ids.uni-hannover.de 的电子邮件经过验证
