Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables DM Hockanson, JL Drewniak, TH Hubing, TP Van Doren, F Sha, ... IEEE Transactions on electromagnetic compatibility 38 (4), 557-566, 1996 | 347 | 1996 |
EMI from cavity modes of shielding enclosures-FDTD modeling and measurements M Li, J Nuebel, JL Drewniak, RE DuBroff, TH Hubing, TP Van Doren IEEE Transactions on Electromagnetic Compatibility 42 (1), 29-38, 2000 | 271 | 2000 |
Electromagnetic interference (EMI) of system-on-package (SOP) T Sudo, H Sasaki, N Masuda, JL Drewniak IEEE Transactions on Advanced Packaging 27 (2), 304-314, 2004 | 253 | 2004 |
Power bus decoupling on multilayer printed circuit boards TH Hubing, JL Drewniak, TP Van Doren, DM Hockanson IEEE Transactions on Electromagnetic Compatibility 37 (2), 155-166, 1995 | 247 | 1995 |
Numerical modeling of electrostatic discharge generators K Wang, D Pommerenke, R Chundru, T Van Doren, JL Drewniak, ... IEEE Transactions on electromagnetic compatibility 45 (2), 258-271, 2003 | 189 | 2003 |
PCB design for real-world EMI control BR Archambeault, J Drewniak Springer Science & Business Media, 2013 | 172 | 2013 |
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances C Wang, J Mao, G Selli, S Luan, L Zhang, J Fan, DJ Pommerenke, ... IEEE Transactions on Advanced Packaging 29 (2), 320-334, 2006 | 143 | 2006 |
Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs J Fan, JL Drewniak, JL Knighten, NW Smith, A Orlandi, TP Van Doren, ... IEEE Transactions on Electromagnetic Compatibility 43 (4), 588-599, 2001 | 138 | 2001 |
Modeling of shielding composite materials and structures for microwave frequencies M Koledintseva, J Drewniak, R DuBroff, K Rozanov, B Archambeault Progress In Electromagnetics Research B 15, 197-215, 2009 | 131 | 2009 |
Quantifying EMI resulting from finite-impedance reference planes DM Hockanson, JL Dreniak, TH Hubing, TP Van Doren, F Sha, CW Lam IEEE Transactions on Electromagnetic Compatibility 39 (4), 286-297, 1997 | 129 | 1997 |
Power-bus decoupling with embedded capacitance in printed circuit board design M Xu, TH Hubing, J Chen, TP Van Doren, JL Drewniak, RE DuBroff IEEE Transactions on Electromagnetic Compatibility 45 (1), 22-30, 2003 | 123 | 2003 |
EMI from airflow aperture arrays in shielding enclosures-experiments, FDTD, and MoM modeling M Li, J Nuebel, JL Drewniak, RE DuBroff, TH Hubing, TP Van Doren IEEE transactions on Electromagnetic Compatibility 42 (3), 265-275, 2000 | 122 | 2000 |
Hand-assembled cable bundle modeling for crosstalk and common-mode radiation prediction S Sun, G Liu, JL Drewniak, DJ Pommerenke IEEE Transactions on electromagnetic compatibility 49 (3), 708-718, 2007 | 111 | 2007 |
Causal RLGC() Models for Transmission Lines From Measured -Parameters J Zhang, JL Drewniak, DJ Pommerenke, MY Koledintseva, RE DuBroff, ... IEEE Transactions on Electromagnetic Compatibility 52 (1), 189-198, 2009 | 108 | 2009 |
EMI mitigation with multilayer power-bus stacks and via stitching of reference planes X Ye, DA Hockanson, M Li, Y Ren, W Cui, JL Drewniak, RE DuBroff IEEE Transactions on electromagnetic compatibility 43 (4), 538-548, 2001 | 108 | 2001 |
A three-dimensional FDTD subgridding algorithm with separated temporal and spatial interfaces and related stability analysis K Xiao, DJ Pommerenke, JL Drewniak IEEE Transactions on Antennas and Propagation 55 (7), 1981-1990, 2007 | 107 | 2007 |
Comparison of FDTD algorithms for subcellular modeling of slots in shielding enclosures KP Ma, M Li, JL Drewniak, TH Hubing, TP Van Doren IEEE Transactions on Electromagnetic Compatibility 39 (2), 147-155, 1997 | 99 | 1997 |
FDTD modeling of common-mode radiation from cables DM Hockanson, JL Drewniak, TH Hubing, TP Van Doren IEEE transactions on electromagnetic compatibility 38 (3), 376-387, 1996 | 99 | 1996 |
Susceptibility scanning as a failure analysis tool for system-level electrostatic discharge (ESD) problems G Muchaidze, J Koo, Q Cai, T Li, L Han, A Martwick, K Wang, J Min, ... IEEE Transactions on Electromagnetic Compatibility 50 (2), 268-276, 2008 | 91 | 2008 |
An EMI estimate for shielding-enclosure evaluation M Li, JL Drewniak, S Radu, J Nuebel, TH Hubing, RE DuBroff, ... IEEE Transactions on Electromagnetic Compatibility 43 (3), 295-304, 2001 | 90 | 2001 |