| Effect of light quality on production of extracellular polysaccharides and growth rate of Porphyridium cruentum T You, SM Barnett Biochemical engineering journal 19 (3), 251-258, 2004 | 214 | 2004 |
| Exacerbated and prolonged inflammation impairs wound healing and increases scarring LW Qian, AB Fourcaudot, K Yamane, T You, RK Chan, KP Leung Wound repair and regeneration 24 (1), 26-34, 2016 | 160 | 2016 |
| Antimicrobial activity of nanoemulsion in combination with cetylpyridinium chloride in multidrug-resistant Acinetobacter baumannii YY Hwang, K Ramalingam, DR Bienek, V Lee, T You, R Alvarez Antimicrobial agents and chemotherapy 57 (8), 3568-3575, 2013 | 109 | 2013 |
| Ceramic temperature sensors for harsh environments OJ Gregory, T You IEEE sensors journal 5 (5), 833-838, 2005 | 90 | 2005 |
| Snail-regulated MiR-375 inhibits migration and invasion of gastric cancer cells by targeting JAK2 Y Xu, J Jin, Y Liu, Z Huang, Y Deng, T You, T Zhou, J Si, W Zhuo PloS one 9 (7), e99516, 2014 | 74 | 2014 |
| Sublethal concentrations of carbapenems alter cell morphology and genomic expression of Klebsiella pneumoniae biofilms TA Van Laar, T Chen, T You, KP Leung Antimicrobial agents and chemotherapy 59 (3), 1707-1717, 2015 | 67 | 2015 |
| The Effect of Denture Cleansing Solutions on the Retention of Pink Locator Attachments after Multiple Pulls: An In Vitro Study W You, R Masri, E Romberg, CF Driscoll, T You Journal of Prosthodontics 20 (6), 464-469, 2011 | 58 | 2011 |
| Effect of aluminum doping on the high-temperature stability and piezoresistive response of indium tin oxide strain sensors OJ Gregory, T You, EE Crisman Thin Solid Films 476 (2), 344-351, 2005 | 56 | 2005 |
| Formation of Pseudomonas aeruginosa Biofilms in Full-thickness Scald Burn Wounds in Rats KS Brandenburg, AJ Weaver Jr, SLR Karna, T You, P Chen, SV Stryk, ... Scientific reports 9 (1), 13627, 2019 | 47 | 2019 |
| Understanding the host inflammatory response to wound infection: An in vivo study of Klebsiella pneumoniae in a rabbit ear wound model AK Seth, MR Geringer, AN Gurjala, JA Abercrombie, P Chen, T You, ... Wound Repair and Regeneration, 2012 | 39 | 2012 |
| Development of Pseudomonas aeruginosa Biofilms in Partial-Thickness Burn Wounds Using a Sprague-Dawley Rat Model KS Brandenburg, AJ Weaver Jr, L Qian, T You, P Chen, SLR Karna, ... Journal of Burn Care & Research 40 (1), 44-57, 2019 | 38 | 2019 |
| Piezoresistive properties of ITO strain sensors prepared with controlled nanoporosity OJ Gregory, T You Journal of the Electrochemical Society 151 (8), H198, 2004 | 38 | 2004 |
| Antimicrobial ceragenins inhibit biofilms and affect mammalian cell viability and migration in vitro MA Olekson, T You, PB Savage, KP Leung FEBS Open Bio 7 (7), 953-967, 2017 | 37 | 2017 |
| Global transcriptome responses including small RNAs during mixed‐species interactions with methicillin‐resistant Staphylococcus aureus and Pseudomonas aeruginosa CL Miller, TA Van Laar, T Chen, SLR Karna, P Chen, T You, KP Leung Microbiologyopen 6 (3), e00427, 2017 | 34 | 2017 |
| Release of a wound‐healing agent from PLGA microspheres in a thermosensitive gel HA Machado, JJ Abercrombie, T You, PP DeLuca, KP Leung BioMed Research International 2013 (1), 387863, 2013 | 33 | 2013 |
| MrkD1P from Klebsiella pneumoniae Strain IA565 Allows for Coexistence with Pseudomonas aeruginosa and Protection from Protease-Mediated Biofilm Detachment BM Childers, TA Van Laar, T You, S Clegg, KP Leung Infection and Immunity 81 (11), 4112-4120, 2013 | 26 | 2013 |
| Thin film ceramic thermocouples O Gregory, G Fralick, J Wrbanek, T You US Patent 8,052,324, 2011 | 20* | 2011 |
| RNA-Seq Transcriptomic Responses of Full-Thickness Dermal Excision Wounds to Pseudomonas aeruginosa Acute and Biofilm Infection SLR Karna, P D’Arpa, T Chen, LW Qian, AB Fourcaudot, K Yamane, ... PLoS One 11 (10), e0165312, 2016 | 19 | 2016 |
| Stability and piezoresistive properties of indium-tin-oxide ceramic strain gages OJ Gregory, T You SENSORS, 2003 IEEE 2, 801-806, 2003 | 14 | 2003 |
| The extended peridynamic model for elastoplastic and/or fracture problems WJ Li, T You, T Ni, QZ Zhu, L Hien Poh International Journal for Numerical Methods in Engineering 123 (21), 5201-5229, 2022 | 13 | 2022 |
