受强制性开放获取政策约束的文章 - Rajeevan Chandel了解详情
无法在其他位置公开访问的文章：13 篇
Variability analysis of stochastic parameters on the electrical performance of on-chip current-mode interconnect system
Y Agrawal, R Chandel, R Dhiman
IETE Journal of Research 63 (2), 268-280, 2017
强制性开放获取政策： Department of Science & Technology, India
Proposal and analysis of relative stability in mixed CNT bundle for sub-threshold interconnects
A Singh, R Chandel, R Dhiman
Integration 80, 29-40, 2021
强制性开放获取政策： Department of Science & Technology, India
Delay analysis of buffer inserted sub-threshold interconnects
R Dhiman, R Chandel
Analog Integrated Circuits and Signal Processing 90, 435-445, 2017
强制性开放获取政策： Department of Science & Technology, India
A proposal, design, and analysis of planar feed gasket antennas with modified substrate for multiband vehicular applications
D Kaushal, R Chandel
IETE Technical Review 40 (2), 268-283, 2023
强制性开放获取政策： Department of Science & Technology, India
Proposal and analysis of carbon nanotube based differential multibit through glass vias
A Kumar, R Chandel, R Dhiman
Microelectronics Journal 126, 105500, 2022
强制性开放获取政策： Department of Science & Technology, India
Modeling of mixed CNT bundle for sub-threshold interconnects
A Singh, R Dhiman, R Chandel
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2018
强制性开放获取政策： Department of Science & Technology, India
Performance analysis of top-contact MLGNR based interconnects
R Kumar, R Dhiman, R Chandel
2016 IEEE International Symposium on Nanoelectronic and Information Systems …, 2016
强制性开放获取政策： Department of Science & Technology, India
Through Silicon Vias for 3D Integration—A Mini Review
Y Arora, V Boora, R Dhiman, R Chandel
Interconnect Technologies for Integrated Circuits and Flexible Electronics …, 2023
强制性开放获取政策： Department of Science & Technology, India
Recurrent Neural Network (RNN) Based Signal Integrity Assessment for Coaxial-Through Glass Vias in Three-Dimensional Integration
S Sachdeva, KM Kiran, R Chandel, R Dhiman
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2024
强制性开放获取政策： Department of Science & Technology, India
Design and Performance Analysis of Voltage-Controlled Oscillator
A Soni, R Dhiman, R Chandel
2023 3rd International Conference on Intelligent Technologies (CONIT), 1-5, 2023
强制性开放获取政策： Department of Science & Technology, India
Signal Integrity Assessment of GNRFET-Based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion
MG Kumar, M Rajeswari, Y Agrawal, R Chandel
ECS Journal of Solid State Science and Technology 12 (4), 041001, 2023
强制性开放获取政策： Department of Science & Technology, India
Implementation of 512-bit SRAM Tile Using the Lector Technique for Leakage Power Reduction
R Chandel, KM Kiran, R Dhiman
Nanoelectronics for Next-Generation Integrated Circuits, 199-222, 2022
强制性开放获取政策： Department of Science & Technology, India
Dual Metal–Double Gate Doping-Less TFET: Design and Investigations
R Kaur, R Dhiman, R Chandel
Nanoscale Devices, 159-172, 2018
强制性开放获取政策： Department of Science & Technology, India
可在其他位置公开访问的文章：1 篇
Electrical characterization and performance analysis of coaxial through-glass vias
V Boora, A Kumar, M Kommukuri, R Chandel, R Dhiman
Sādhanā 49 (1), 44, 2024
强制性开放获取政策： Department of Science & Technology, India
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