| High-speed solder ball shear and pull tests vs. board level mechanical drop tests: correlation of failure mode and loading speed F Song, SWR Lee, K Newman, B Sykes, S Clark 2007 Proceedings 57th Electronic Components and Technology Conference, 1504-1513, 2007 | 88 | 2007 |
| Investigation of IMC thickness effect on the lead-free solder ball attachment strength: comparison between ball shear test and cold bump pull test results F Song, SWR Lee 56th Electronic Components and Technology Conference 2006, 8 pp., 2006 | 79 | 2006 |
| Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests F Song, SWR Lee, K Newman, B Sykes, S Clark 2007 Proceedings 57th Electronic Components and Technology Conference, 364-372, 2007 | 78 | 2007 |
| Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints C Yang, F Song, SWR Lee Microelectronics Reliability 54 (2), 435-446, 2014 | 42 | 2014 |
| Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability F Song, SWR Lee 56th Electronic Components and Technology Conference 2006, 8 pp., 2006 | 39 | 2006 |
| Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls F Song, SWR Lee, K Newman, H Reynolds, S Clark, B Sykes 2007 9th Electronics Packaging Technology Conference, 463-470, 2007 | 31 | 2007 |
| Flip chip and wire bond semiconductor package CS Foong, A Ismail, WY Lo, BH Liau, JM Liu, JH Wang, JZ Yao, FB Song US Patent 7,554,185, 2009 | 30 | 2009 |
| Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish C Yang, F Song, SWR Lee 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 971-978, 2011 | 26 | 2011 |
| Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test F Song, SWR Lee, K Newman, S Clark, B Sykes 2007 9th Electronics Packaging Technology Conference, 450-458, 2007 | 20 | 2007 |
| Solder ball attachment assessment of reballed plastic ball grid array packages L Nie, M Osterman, F Song, J Lo, SWR Lee, M Pecht IEEE transactions on components and packaging technologies 32 (4), 901-908, 2009 | 17 | 2009 |
| Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays Q Zhang, C Yang, M Tao, F Song, SWR Lee 2013 IEEE 63rd Electronic Components and Technology Conference, 1788-1793, 2013 | 16 | 2013 |
| Comparative study of PWB pad cratering subject to reflow soldering and thermal impact C Yang, F Song, SWR Lee, K Newman 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 16 | 2010 |
| Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls F Songa, SWR Lee, F Song 2005 6th International Conference on Electronic Packaging Technology, 1-7, 2005 | 16 | 2005 |
| Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors F Song, C Yang, HLH Wu, CCJ Lo, SWR Lee, K Newman 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 14 | 2010 |
| Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis F Song, K Newman, C Yang, SWR Lee 2009 11th Electronics Packaging Technology Conference, 863-868, 2009 | 14 | 2009 |
| A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders F Song, JCC Lo, JKS Lam, T Jiang, SWR Lee 2008 58th Electronic Components and Technology Conference, 146-154, 2008 | 14 | 2008 |
| Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability HLH Wu, F Song, JCC Lo, T Jiang, K Newman, SWR Lee 2009 59th Electronic Components and Technology Conference, 125-133, 2009 | 12 | 2009 |
| Development of innovative cold pin pull test method for solder pad crater evaluation Q Zhang, C Yang, M Tao, F Song, SWR Lee 2012 14th International Conference on Electronic Materials and Packaging …, 2012 | 11 | 2012 |
| Characterization and comparison of five SAC-based solder pastes for Pb-free reflow soldering CH Chen, W Wong, JCC Lo, F Song, SWR Lee 2007 International Symposium on High Density packaging and Microsystem …, 2007 | 10 | 2007 |
| Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball Shear Tests vs. Cold Bump Pull Tests SWR Lee, F Song 2006 International Microsystems, Package, Assembly Conference Taiwan, 1-4, 2006 | 10 | 2006 |
