| Handbook of silicon based MEMS materials and technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Krockel, ... William Andrew, 2015 | 694* | 2015 |
| Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013 | 422 | 2013 |
| Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 2015 | 399* | 2015 |
| Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015 | 328 | 2015 |
| Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016 | 139 | 2016 |
| Pressure sensors based on suspended graphene membranes AD Smith, S Vaziri, F Niklaus, AC Fischer, M Sterner, A Delin, M Östling, ... Solid-State Electronics 88, 89-94, 2013 | 91 | 2013 |
| Unconventional applications of wire bonding create opportunities for microsystem integration AC Fischer, JG Korvink, N Roxhed, G Stemme, U Wallrabe, F Niklaus Journal of Micromechanics and Microengineering 23 (8), 083001, 2013 | 87 | 2013 |
| Flexible and stretchable microneedle patches with integrated rigid stainless steel microneedles for transdermal biointerfacing M Rajabi, N Roxhed, RZ Shafagh, T Haraldson, AC Fischer, W Wijngaart, ... PloS one 11 (12), e0166330, 2016 | 83 | 2016 |
| Graphene-based CO 2 sensing and its cross-sensitivity with humidity AD Smith, K Elgammal, X Fan, MC Lemme, A Delin, M Råsander, ... RSC advances 7 (36), 22329-22339, 2017 | 82 | 2017 |
| High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires FN Simon J Bleiker, Andreas C Fischer, Umer Shah, Nutapong Somjit, Tommy ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015 | 59* | 2015 |
| Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus Journal of Micromechanics and Microengineering 22 (10), 105001, 2012 | 47 | 2012 |
| CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration FN Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland, Stian Martinsen ... Selected Topics in Quantum Electronics, IEEE Journal of 21 (4), 1-11, 2015 | 41* | 2015 |
| 3D Free‐Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching AC Fischer, LM Belova, YGM Rikers, BG Malm, HH Radamson, ... Advanced Functional Materials 22 (19), 4004-4008, 2012 | 39 | 2012 |
| Chapter 26: Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS AC Fischer, M Mäntysalo, F Niklaus, M Tilli, T Motooka, VM Airaksinen, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edion), 2015 | 37* | 2015 |
| Low-cost uncooled microbolometers for thermal imaging N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ... Proc. SPIE, 772611, 2010 | 30 | 2010 |
| Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires AC Fischer, N Roxhed, T Haraldsson, N Heinig, G Stemme, F Niklaus Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International …, 2011 | 26 | 2011 |
| Wire-bonded through-silicon vias with low capacitive substrate coupling AC Fischer, M Grange, N Roxhed, R Weerasekera, D Pamunuwa, ... Journal of Micromechanics and Microengineering 21, 085035, 2011 | 23 | 2011 |
| Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ... Infrared physics & technology 60, 251-259, 2013 | 22 | 2013 |
| Stress-Minimized Packaging of Inertial Sensors by Double-Sided Bond Wire Attachment SH Stephan Schroder, Frank Niklaus, Alexandra Nafari, Eskild R Westby ... Microelectromechanical Systems, Journal of 24 (4), 781-789, 2015 | 21* | 2015 |
| Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays P Ericsson, AC Fischer, F Forsberg, N Roxhed, B Samel, S Savage, ... SPIE Defense, Security, and Sensing, 801216-801216-10, 2011 | 20 | 2011 |
Frank NiklausProfessor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden在 kth.se 的电子邮件经过验证
