| Realization of a near-perfect antireflection coating for silicon solar energy utilization ML Kuo, DJ Poxson, YS Kim, FW Mont, JK Kim, EF Schubert, SY Lin Optics letters 33 (21), 2527-2529, 2008 | 341 | 2008 |
| Design of multilayer antireflection coatings made from co-sputtered and low-refractive-index materials by genetic algorithm MF Schubert, FW Mont, S Chhajed, DJ Poxson, JK Kim, EF Schubert Optics express 16 (8), 5290-5298, 2008 | 236 | 2008 |
| High-refractive-index TiO2-nanoparticle-loaded encapsulants for light-emitting diodes FW Mont, JK Kim, MF Schubert, EF Schubert, RW Siegel Journal of applied physics 103 (8), 2008 | 197 | 2008 |
| Quantification of porosity and deposition rate of nanoporous films grown by oblique-angle deposition DJ Poxson, FW Mont, MF Schubert, JK Kim, EF Schubert Applied Physics Letters 93 (10), 2008 | 132 | 2008 |
| Effects of the refractive index of the encapsulant on the light-extraction efficiency of light-emitting diodes M Ma, FW Mont, X Yan, J Cho, EF Schubert, GB Kim, C Sone Optics express 19 (105), A1135-A1140, 2011 | 109 | 2011 |
| Refractive-index-matched indium–tin-oxide electrodes for liquid crystal displays X Yan, FW Mont, DJ Poxson, MF Schubert, JK Kim, J Cho, EF Schubert Japanese Journal of Applied Physics 48 (12R), 120203, 2009 | 109 | 2009 |
| Broadband omnidirectional antireflection coatings optimized by genetic algorithm DJ Poxson, MF Schubert, FW Mont, EF Schubert, JK Kim Optics letters 34 (6), 728-730, 2009 | 97 | 2009 |
| On resonant optical excitation and carrier escape in GaInN/GaN quantum wells MF Schubert, J Xu, Q Dai, FW Mont, JK Kim, EF Schubert Applied Physics Letters 94 (8), 2009 | 86 | 2009 |
| Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars JK Kim, AN Noemaun, FW Mont, D Meyaard, EF Schubert, DJ Poxson, ... Applied Physics Letters 93 (22), 2008 | 86 | 2008 |
| Optical thin film, semiconductor light emitting device having the same and methods of fabricating the same J Cho, FW Mont, C Sone, JK Kim, J Song, EF Schubert US Patent 7,483,212, 2009 | 70 | 2009 |
| Future on-chip interconnect metallization and electromigration CK Hu, J Kelly, H Huang, K Motoyama, H Shobha, Y Ostrovski, JHC Chen, ... 2018 IEEE International Reliability Physics Symposium (IRPS), 4F. 1-1-4F. 1-6, 2018 | 69 | 2018 |
| High-performance antireflection coatings utilizing nanoporous layers DJ Poxson, ML Kuo, FW Mont, YS Kim, X Yan, RE Welser, AK Sood, ... MRS bulletin 36 (6), 434-438, 2011 | 63 | 2011 |
| Very high quality AlN grown on (0001) sapphire by metal-organic vapor phase epitaxy YA Xi, KX Chen, F Mont, JK Kim, C Wetzel, EF Schubert, W Liu, X Li, ... Applied physics letters 89 (10), 2006 | 60 | 2006 |
| Tungsten and cobalt metallization: A material study for MOL local interconnects V Kamineni, M Raymond, S Siddiqui, F Mont, S Tsai, C Niu, A Labonte, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 59 | 2016 |
| Performance of antireflection coatings consisting of multiple discrete layers and comparison with continuously graded antireflection coatings MF Schubert, DJ Poxson, FW Mont, JK Kim, EF Schubert Applied Physics Express 3 (8), 082502, 2010 | 58 | 2010 |
| High transmittance optical windows and method of constructing the same RE Welser, AK Sood, DJ Poxson, S Chhajed, FW Mont, J Cho, ... US Patent App. 12/946,580, 2011 | 56 | 2011 |
| Experimental study of nanoscale Co damascene BEOL interconnect structures J Kelly, JHC Chen, H Huang, CK Hu, E Liniger, R Patlolla, B Peethala, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 53 | 2016 |
| Ruthenium interconnect resistivity and reliability at 48 nm pitch X Zhang, H Huang, R Patlolla, W Wang, FW Mont, J Li, CK Hu, EG Liniger, ... 2016 IEEE international interconnect technology conference/advanced …, 2016 | 53 | 2016 |
| Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires CK Hu, J Kelly, JHC Chen, H Huang, Y Ostrovski, R Patlolla, B Peethala, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 47 | 2017 |
| Cobalt interconnect on same copper barrier process integration at the 7nm node FW Mont, X Zhang, W Wang, JJ Kelly, TE Standaert, R Quon, ET Ryan 2017 IEEE international interconnect technology conference (IITC), 1-3, 2017 | 47 | 2017 |
