| In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon Microelectronic Engineering 85 (9), 1851-1857, 2008 | 66 | 2008 |
| Low-stress thermosonic copper ball bonding A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon IEEE Transactions on Electronics Packaging Manufacturing 32 (3), 176-184, 2009 | 58 | 2009 |
| Ultrasonic friction power during Al wire wedge-wedge bonding A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou Journal of applied physics 106 (1), 2009 | 43 | 2009 |
| Advances in wire bonding technology for 3D die stacking and fan out wafer level package I Qin, O Yauw, G Schulze, A Shah, B Chylak, N Wong 2017 IEEE 67th electronic components and technology conference (ECTC), 1309-1315, 2017 | 41 | 2017 |
| Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon Microelectronics Reliability 51 (1), 67-74, 2011 | 39 | 2011 |
| Role of process parameters on bondability and pad damage indicators in copper ball bonding I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou Microelectronics Reliability 51 (1), 60-66, 2011 | 34 | 2011 |
| The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor H Gaul, A Shah, M Mayer, Y Zhou, M Schneider-Ramelow, H Reichl Microelectronic Engineering 87 (4), 537-542, 2010 | 24 | 2010 |
| Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding A Rezvani, A Shah, M Mayer, Y Zhou, JT Moon Microelectronics Reliability 53 (7), 1002-1008, 2013 | 20 | 2013 |
| Ultrasonic friction power during thermosonic Au and Cu ball bonding A Shah, M Mayer, I Qin, C Huynh, Y Zhou, M Meyer Journal of Physics D: Applied Physics 43 (32), 325301, 2010 | 20 | 2010 |
| Reduction of underpad stress in thermosonic copper ball bonding A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon 2008 58th Electronic Components and Technology Conference, 2123-2130, 2008 | 19 | 2008 |
| Free-air ball formation and deformability with Pd coated Cu wire A Rezvani, M Mayer, A Shah, N Zhou, SJ Hong, JT Moon 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1516-1522, 2011 | 18 | 2011 |
| Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor A Shah, J Lee, M Mayer, YN Zhou Sensors and Actuators A: Physical 148 (2), 462-471, 2008 | 18 | 2008 |
| Availability analysis of a generalized maintainable three‐state device parallel system with human error and common‐cause failures BS Dhillon, AS Shah Journal of quality in maintenance Engineering 13 (4), 411-432, 2007 | 18 | 2007 |
| Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding A Shah, M Mayer, Y Zhou, J Persic, JT Moon 2009 11th Electronics Packaging Technology Conference, 10-15, 2009 | 16 | 2009 |
| Effect of process parameters on pad damage during Au and Cu ball bonding processes I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou 2009 11th Electronics Packaging Technology Conference, 573-578, 2009 | 13 | 2009 |
| Advances in wire bonding technology for different bonding wire material I Qin, A Shah, H Xu, B Chylak, N Wong International Symposium on Microelectronics 2015 (1), 000406-000412, 2015 | 12 | 2015 |
| Reliability and availability analysis of three-state device redundant systems with human errors and common-cause failures ASBS DHILLON International Journal of Performability Engineering 3 (4), 411, 2007 | 12 | 2007 |
| Advanced wire bonding technology for Ag wire A Shah, T Rockey, H Xu, I Qin, W Jie, O Yauw, B Chylak 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015 | 11 | 2015 |
| Thermosonic Au ball bonding process investigated using microsensor and laser vibrometer I Qin, A Shah, C Huynh, D DeAngelis, M Meyer, M Mayer, Y Zhou 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 9 | 2010 |
| Ball Bond Process Optimization with Cu and Pd Coated Cu Wire I Qin, B Chylak, H Clauberg, A Shah, J Foley Proceedings of Semicon China Conference 2012, 2012 | 8 | 2012 |
Michael MayerAssociate Professor of Mechanical and Mechatronics Engineering, University of Waterloo在 uwaterloo.ca 的电子邮件经过验证
