| An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model Y Lai, K Pan, Y Cen, J Yang, C Cai, P Yin, S Park Soldering & Surface Mount Technology 34 (5), 266-276, 2022 | 36 | 2022 |
| Smarter temperature setup for reflow oven to minimize temperature variation among components Y Lai, K Pan, C Cai, P Yin, J Yang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 24 | 2022 |
| Reflow recipe establishment based on CFD-Informed machine learning model Y Lai, JH Ha, KA Deo, J Yang, P Yin, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 16 | 2023 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 15 | 2022 |
| Shape dependency of fatigue life in solder joints of chip resistors J Ha, C Cai, P Yin, Y Lai, K Pan, J Yang, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1489-1494, 2022 | 14 | 2022 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 13 | 2022 |
| Optimal thermo-mechanical reliability design of 2.5 D lidless package J Yang, C Cai, P Yin, K Pan, Y Lai, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 13 | 2022 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 12 | 2022 |
| Parametric study of the geometry design of through-silicon via in silicon interposer K Pan, Y Lai, J Xu, P Yin, J Ha, C Cai, J Yang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 11 | 2022 |
| Shock performance enhancement of a container for rack server P Yin, H Wang, J Xu, V Pham, S Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 8 | 2020 |
| Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life J Ha, Y Lai, J Yang, P Yin, S Park Journal of Electronic Packaging 146 (2), 2024 | 6 | 2024 |
| Package Design Through Reliable Predictive Modeling and Its Validation P Yin, S Park, B Jacob, L Yin, A Gowda 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1738-1744, 2022 | 6 | 2022 |
| Enhanced solder fatigue life of chip resistor by optimizing solder shape J Ha, Y Lai, J Yang, P Yin, S Park Microelectronics Reliability 145, 114994, 2023 | 5 | 2023 |
| Shipping container design improvement analysis for drop/shock loading P Yin, S Park, G Pandiarajan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2145-2150, 2021 | 5 | 2021 |
| A Technical Review on State of the Art In-Plane and Out-of-Plane Deformation Measurement Techniques for Microelectronic Packages KA Deo, P Yin, J Yang, JH Ha, SB Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 907-913, 2023 | 4 | 2023 |
| Reflow Oven Zone Temperature Advisor using the AI-Driven Smart Recipe Generator Y Lai, P Yin, J Yang, J Ha, KA Deo, S Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1773-1778, 2023 | 4 | 2023 |
| Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment P Yin, J Ha, J Yang, Y Lai, S Park, B Jacob 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1085-1090, 2023 | 3 | 2023 |
| Drop-impact simulation and validation of foam packaging P Yin State University of New York at Binghamton, 2020 | 3 | 2020 |
| A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage C Cai, H Wang, J Yang, P Yin, SB Park Journal of Electronic Packaging 146 (2), 2024 | 2 | 2024 |
| Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV) J Yang, K Pan, P Yin, Y Lai, S Park, C Okoro, D Joshi, S Pollard 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1820-1825, 2024 | 1 | 2024 |
