Amogh Biju 个人学术档案 - 学术资源搜索

202320242 2

Amogh Biju

在 usc.edu 的电子邮件经过验证


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
The Challenge of Multiple Thermal Comfort Prediction Models: Is TSV Enough? B Lala, A Biju, Vanshita, A Rastogi, K Dahiya, SM Kala, A Hagishima Buildings 13 (4), 890, 2023	4	2023
Architecture, Performance, and Usability of Mobile Cellular Network Monitoring Applications for Data-driven Analysis SM Kala, M Mishra, A Biju, V Sathya, T Amano, T Higashino, ... IEEE Access, 2024		2024

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