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| Structure and method for 3D IC package SY Hou, DC Yeh, S Jeng, CH Yu US Patent 8,993,380, 2015 | 698 | 2015 |
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| Structure and properties of epitaxial Ba0.5Sr0.5TiO3/SrRuO3/ZrO2 heterostructure on Si grown by off‐axis sputtering SY Hou, J Kwo, RK Watts, JY Cheng, DK Fork Applied physics letters 67 (10), 1387-1389, 1995 | 143 | 1995 |
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Douglas C.H. YuTaiwan Semiconductor Manufacturing Company Ltd.在 tsmc.com 的电子邮件经过验证
Douglas C.H. YuTaiwan Semiconductor Manufacturing Company Ltd.在 tsmc.com 的电子邮件经过验证
Douglas C.H. YuTaiwan Semiconductor Manufacturing Co在 tsmc.com 的电子邮件经过验证