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合著作者
John BowersProfessor of Electrical and Computer Engineering, UCSB在 ece.ucsb.edu 的电子邮件经过验证- Patrick AbrahamLynred在 lynred.com 的电子邮件经过验证
- Steven DenBaarsProfessor of Materials, University of California Santa Barbara在 engineering.ucsb.edu 的电子邮件经过验证
- Dubravko BabicFaculty of electrical engineering and computing, University of Zagreb, Croatia在 fer.hr 的电子邮件经过验证
- Ali ShakouriProfessor of Electrical and Computer Engineering, Purdue University在 purdue.edu 的电子邮件经过验证
- E. Fred Schubert, Future Chips Conste...Rensselaer Polytechnic Institute在 rpi.edu 的电子邮件经过验证
- Evelyn L. HuTarr Coyne Professor of Applied Physics and of Electrical Engineering在 seas.harvard.edu 的电子邮件经过验证
- Adil KarimJohns Hopkins University, Applied Physics Laboratory在 jhuapl.edu 的电子邮件经过验证
- Hans WenzelFerdinand-Braun-Institut, Humboldt-Universität在 fbh-berlin.de 的电子邮件经过验证
- Qi DaiProfessor, School of Information Science & Technology, Fudan University在 fudan.edu.cn 的电子邮件经过验证
- Jong Kyu KimProfessor,POSTECH在 postech.ac.kr 的电子邮件经过验证
- Adrian KeatingThe University of Western Asutralia在 uwa.edu.au 的电子邮件经过验证
- L. A. ColdrenProf. of ECE, University of California, Santa Barbara在 ece.ucsb.edu 的电子邮件经过验证
- Martin F SchubertGoogle在 google.com 的电子邮件经过验证
- Jong-In ShimDept. of Electronics and Communication Eng., Hanyang University ERICA Campus在 hanyang.ac.kr 的电子邮件经过验证
- Richard MirinNIST在 nist.gov 的电子邮件经过验证
- Michael KneisslProfessor, Institute of Solid State Physics, TU Berlin, Germany在 physik.tu-berlin.de 的电子邮件经过验证
- Robert M. FarrellAssistant Professor, ECE Department, University of Wisconsin–Madison在 wisc.edu 的电子邮件经过验证
- Kenton WhiteUniversity of Ottawa在 uottawa.ca 的电子邮件经过验证
- Jim SpeckProfessor of Materials, UCSB在 ucsb.edu 的电子邮件经过验证
