| High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates M Łysień, Ł Witczak, A Wiatrowska, K Fiączyk, J Gadzalińska, L Schneider, ... Scientific reports 12 (1), 9327, 2022 | 28 | 2022 |
| Synthesis and characterization of Ag NPs templated via polymerization induced self-assembly Y Zhang, P Filipczak, G He, G Nowaczyk, L Witczak, W Raj, M Kozanecki, ... Polymer 129, 144-150, 2017 | 25 | 2017 |
| Tandem Si Micropillar Array Photocathodes with Conformal Copper Oxide and a Protection Layer by Pulsed Laser Deposition PP Kunturu, C Zachariadis, L Witczak, MD Nguyen, G Rijnders, J Huskens ACS applied materials & interfaces 11 (44), 41402-41414, 2019 | 19 | 2019 |
| Silica core/conjugated polymer shell particles via seeded Knoevenagel dispersion polymerization–laser action in whispering gallery mode resonators S Ciftci, A Mikosch, B Haehnle, Ł Witczak, AJC Kuehne Chemical Communications 52 (99), 14222-14225, 2016 | 18 | 2016 |
| 59‐3: Ultra‐Precise Printing of Micrometer‐Size Interconnectors for High‐Resolution MicroLED Displays A Wiatrowska, P Kowalczewski, K Fiączyk, Ł Witczak, J Gadzalińska, ... SID Symposium Digest of Technical Papers 52 (1), 833-836, 2021 | 7 | 2021 |
| 55‐1: Deposition of Conductive and Insulating Materials at Micrometer Scale for Display‐Component Prototyping M Łysien, Ł Witczak, J Gadzalińska, I Grądzka-Kurzaj, L Schneider, ... SID Symposium Digest of Technical Papers 53 (1), 723-726, 2022 | 4 | 2022 |
| 1000-Pixels per Inch Transistor Arrays Using Multi-Level Imprint Lithography T Dogan, J de Riet, T Bel, I Katsouras, L Witczak, AJ Kronemeijer, ... IEEE Electron Device Letters 41 (8), 1217-1220, 2020 | 4 | 2020 |
| High Frequency Solution‐Processed Organic Field‐Effect Transistors with High‐Resolution Printed Short Channels T Losi, Ł Witczak, M Łysień, P Rossi, P Moretti, C Bertarelli, V Mattoli, ... Advanced Functional Materials 33 (48), 2302656, 2023 | 3 | 2023 |
| Ultraprecise Deposition of Micrometer-Size Conductive Features for Advanced Packaging A Wiatrowska, P Kowalczewski, K Fiączyk, Ł Witczak, J Gadzalińska, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1573-1576, 2022 | 3 | 2022 |
| Flexible Quantum-Dot Light-Emitting Diodes Using Embedded Silver Mesh Transparent Electrodes Manufactured by an Ultraprecise Deposition Method Ł Witczak, M Chrzanowski, P Sitarek, M Łysień, A Podhorodecki ACS omega 8 (42), 39217-39221, 2023 | 2 | 2023 |
| High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology A Roshanghias, M Dreissigacker, I Gradzka-Kurzaj, A Binder, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 1 | 2022 |
| Printing of Micrometer-Size Features on Complex Substrates for System Integration A Wiatrowska, K Fiączyk, P Kowalczewski, M Łysień, Ł Witczak, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 1 | 2022 |
| 27.3: Ultraprecise Deposition of Micrometer‐Size Conductive Structures for Printed Displays A Wiatrowska, P Kowalczewski, K Fiączyk, Ł Witczak, J Gadzalińska, ... SID Symposium Digest of Technical Papers 52, 370-370, 2021 | 1 | 2021 |
| Multi-level nanoimprint lithography for TFT display manufacturing AJ Kronemeijer, L Witczak, T Dogan, J de Riet, T Bel, R Verbeek, J Maas, ... Proc. 18th Int. Conf. Nanoimprint Nanoprint Technol.(NNT), 1-2, 2019 | 1 | 2019 |
| 84‐2: Invited Paper: High‐Resolution Additive Manufacturing in the Fabrication of Micro‐LED Displays F Granek, I Grądzka-Kurzaj, J Gadzalińska, Ł Witczak, K Fiączyk, ... SID Symposium Digest of Technical Papers 55 (1), 1167-1169, 2024 | | 2024 |
| A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application T Wang, CW Lu, E Feng, YJ Yang, CY Chang, PP Cheng, F Lie, A Cheng, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1868-1871, 2024 | | 2024 |
| Method of filling a microcavity with layers of polymeric material J Gadzalińska, Ł Witczak, A Wiatrowska, K Fia̧zyk, P Kowalczewski, ... US Patent 11,931,935, 2024 | | 2024 |
| Method of forming an elongate electrical connection feature traversing a microscopic step Ł Witczak, P Kowalczewski, A Wiatrowska, K Fia̧czyk, Ł Kosior, F Granek US Patent 11,911,814, 2024 | | 2024 |
| Ultra-precise deposition: additive manufacturing process for next-generation electronics K Duczmal, P Kowalczewski, Ł Witczak, J Gadzalińska, I Grądzka-Kurzaj, ... Transactions on Additive Manufacturing Meets Medicine 5 (S1), 832-832, 2023 | | 2023 |
| Printing of Conductive and Insulating Structures with Micrometer Resolution for Next-Generation Displays W Aneta, K Piotr, F Karolina, W Lukasz, G Jolanta, GK Iwona, L Mateusz, ... Proceedings of the International Display Workshops, 291, 2022 | | 2022 |
