标题/作者	年份
Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene aerogel framework X Yang, S Fan, Y Li, Y Guo, Y Li, K Ruan, S Zhang, J Zhang, J Kong, J Gu Composites Part A: Applied Science and Manufacturing 128, 105670	2020
Enhanced thermal conductivities of epoxy nanocomposites via incorporating in-situ fabricated hetero-structured SiC-BNNS fillers Y Han, X Shi, X Yang, Y Guo, J Zhang, J Kong, J Gu Composites Science and Technology 187, 107944	2020
Three-dimensional interconnected networks for thermally conductive polymer composites: Design, preparation, properties, and mechanisms F Zhang, Y Feng, W Feng Materials Science and Engineering: R: Reports 142, 100580	2020
Interfacial thermal resistance in thermally conductive polymer composites: a review K Ruan, X Shi, Y Guo, J Gu Composites Communications 22, 100518	2020
Intrinsic high thermal conductive liquid crystal epoxy film simultaneously combining with excellent intrinsic self-healing performance X Yang, X Zhong, J Zhang, J Gu Journal of Materials Science & Technology 68, 209-215	2021
Flexible thermally conductive and electrically insulating silicone rubber composite films with [email protected] Al 2 O 3 fillers H Yan, X Dai, K Ruan, S Zhang, X Shi, Y Guo, H Cai, J Gu Advanced Composites and Hybrid Materials 4, 36-50	2021
Highly thermal conductive and electrical insulating polymer composites with boron nitride M Li, M Wang, X Hou, Z Zhan, H Wang, H Fu, CT Lin, L Fu, N Jiang, J Yu Composites Part B: Engineering 184, 107746	2020
Enhanced thermal conductivity of polydimethylsiloxane composites with carbon fiber J Wei, M Liao, A Ma, Y Chen, Z Duan, X Hou, M Li, N Jiang, J Yu Composites Communications 17, 141-146	2020
Highly thermal conductive, anisotropically heat-transferred, mechanically flexible composite film by assembly of boron nitride nanosheets for thermal management ZG Wang, W Liu, YH Liu, Y Ren, YP Li, L Zhou, JZ Xu, J Lei, ZM Li Composites Part B: Engineering 180, 107569	2020
Thermally conductive and insulating epoxy composites by synchronously incorporating Si-sol functionalized glass fibers and boron nitride fillers RH Zhang, XT Shi, L Tang, Z Liu, JL Zhang, YQ Guo, JW Gu Chinese Journal of Polymer Science 38, 730-739	2020
Enhanced dielectric properties and energy storage density of PVDF nanocomposites by co-loading of BaTiO 3 and CoFe 2 O 4 nanoparticles Q Wang, J Zhang, Z Zhang, Y Hao, K Bi Advanced Composites and Hybrid Materials 3, 58-65	2020
Ultra-thin broccoli-like [email protected] TiO2 one-dimensional electromagnetic wave absorbing material H Liang, J Liu, Y Zhang, L Luo, H Wu Composites Part B: Engineering 178, 107507	2019
Synergistic effect of functionalized graphene/boron nitride on the thermal conductivity of polystyrene composites F Jiang, X Cui, N Song, L Shi, P Ding Composites Communications 20, 100350	2020
Facile synthesis of hierarchical A-site cation deficiency perovskite LaxFeO3-y/RGO for high efficiency microwave absorption Z Jia, Z Gao, K Kou, A Feng, C Zhang, B Xu, G Wu Composites Communications 20, 100344	2020
Random copolymer membrane coated PBO fibers with significantly improved interfacial adhesion for PBO fibers/cyanate ester composites T Lin, J ZHANG, GU Junwei Chinese Journal of Aeronautics 34 (2), 659-668	2021
Recent advances in polymer-based thermal interface materials for thermal management: A mini-review CP Feng, LY Yang, J Yang, L Bai, RY Bao, ZY Liu, MB Yang, HB Lan, ... Composites Communications 22, 100528	2020
Enhanced thermal conductivity and retained electrical insulation of heat spreader by incorporating alumina-deposited graphene filler in nano-fibrillated cellulose S Guo, R Zheng, J Jiang, J Yu, K Dai, C Yan Composites Part B: Engineering 178, 107489	2019
Three-dimensional carbon fiber-graphene network for improved thermal conductive properties of polyamide-imide composites T Xu, S Zhou, S Cui, N Song, L Shi, P Ding Composites Part B: Engineering 178, 107495	2019
Nest-like hetero-structured [email protected] SiCnws fillers and significant improvement on thermal conductivities of epoxy composites Y Han, X Shi, S Wang, K Ruan, C Lu, Y Guo, J Gu Composites Part B: Engineering 210, 108666	2021
Preparation of highly thermally conductive and electrically insulating PI/BNNSs nanocomposites by hot-pressing self-assembled PI/BNNSs microspheres L Cao, J Wang, J Dong, X Zhao, HB Li, Q Zhang Composites Part B: Engineering 188, 107882	2020

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