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h5 指数:39
h5 中位数:50

h5 指数是指在过去整整 5 年中所发表文章的 h 指数。h 指在 2017-2021 年间发表的 h 篇文章每篇至少都被引用过 h 次的最大值。隐藏

出版物的 h5 中位数，是指出版物的 h5 指数所涵盖的所有文章获得的引用次数的中位值。隐藏

#7 Electromagnetism

标题/作者	引用次数	年份
A Resonant Reactive Shielding for Planar Wireless Power Transfer System in Smartphone Application J Park, D Kim, K Hwang, HH Park, SI Kwak, JH Kwon, S Ahn IEEE Transactions on Electromagnetic Compatibility 59 (2), 695-703	107	2017
A 2.5-D Angularly Stable Frequency Selective Surface Using Via-Based Structure for 5G EMI Shielding D Li, TW Li, EP Li, YJ Zhang IEEE Transactions on Electromagnetic Compatibility 60 (3), 768-775	85	2017
Broadband Polarization-Insensitive Tunable Frequency Selective Surface for Wideband Shielding S Ghosh, KV Srivastava IEEE Transactions on Electromagnetic Compatibility 60 (1), 166-172	83	2017
Near-Field Reduction in a Wireless Power Transfer System Using LCC Compensation T Campi, S Cruciani, F Maradei, M Feliziani IEEE Transactions on Electromagnetic Compatibility 59 (2), 686-694	82	2017
A Wideband Frequency Tunable FSS for Electromagnetic Shielding Applications R Sivasamy, B Moorthy, M Kanagasabai, VR Samsingh, MGN Alsath IEEE Transactions on Electromagnetic Compatibility 60 (1), 280-283	81	2017
5G Over-the-Air Measurement Challenges: Overview Y Qi, G Yang, L Liu, J Fan, A Orlandi, H Kong, W Yu, Z Yang IEEE Transactions on Electromagnetic Compatibility 59 (6), 1661-1670	81	2017
Atom-Based RF Electric Field Metrology: From Self-Calibrated Measurements to Subwavelength and Near-Field Imaging CL Holloway, MT Simons, JA Gordon, PF Wilson, CM Cooke, ... IEEE Transactions on Electromagnetic Compatibility 59 (2), 717-728	78	2017
High-Speed Channel Modeling With Machine Learning Methods for Signal Integrity Analysis T Lu, J Sun, K Wu, Z Yang IEEE Transactions on Electromagnetic Compatibility 60 (6), 1957-1964	71	2018
Design of PIFA With Metamaterials for Body-SAR Reduction in Wearable Applications SI Kwak, DU Sim, JH Kwon, YJ Yoon IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY 59 (1), 297-300	67	2017
Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems Y Cho, S Lee, DH Kim, H Kim, C Song, S Kong, J Park, C Seo, J Kim IEEE Transactions on Electromagnetic Compatibility 60 (4), 1001-1009	65	2017
Physics-Based Dipole Moment Source Reconstruction for RFI on a Practical Cellphone Q Huang, F Zhang, T Enomoto, J Maeshima, K Araki, C Hwang IEEE Transactions on Electromagnetic Compatibility 59 (6), 1693-1700	63	2017
An Alternative Method for Locating Faults in Transmission Line Networks Based on Time Reversal A Codino, Z Wang, R Razzaghi, M Paolone, F Rachidi IEEE Transactions on Electromagnetic Compatibility 59 (5), 1601-1612	60	2017
Evaluation of Power System Lightning Performance, Part I: Model and Numerical Solution Using the PSCAD-EMTDC Platform M Brignone, F Delfino, R Procopio, M Rossi, F Rachidi IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY 59 (1), 137-145	58	2017
Lightning Grounding Grid Model Considering Both the Frequency-Dependent Behavior and Ionization Phenomenon H Chen, Y Du IEEE Transactions on Electromagnetic Compatibility 61 (1), 157-165	58	2018
Possibility of Protection Against UWB Pulses Based on a Turn of a Meander Microstrip Line RS Surovtsev, AV Nosov, AM Zabolotsky, TR Gazizov IEEE Transactions on Electromagnetic Compatibility 59 (6), 1864-1871	58	2017
A Low-Profile Broadband Bandpass Frequency Selective Surface With Two Rapid Band Edges for 5G Near-Field Applications D Li, TW Li, R Hao, HS Chen, WY Yin, HC Yu, EP Li IEEE Transactions on Electromagnetic Compatibility 59 (2), 670-676	55	2017
Tunable Graphene-Based Metasurface for Polarization-Independent Broadband Absorption in Lower Mid-Infrared (MIR) Range SK Ghosh, VS Yadav, S Das, S Bhattacharyya IEEE Transactions on Electromagnetic Compatibility 62 (2), 346-354	53	2019
Metamaterial Structure Integrated With a Dielectric Absorber for Wideband Reduction of Antennas Radar Cross Section HB Baskey, E Johari, MJ Akhtar IEEE Transactions on Electromagnetic Compatibility 59 (4), 1060-1069	53	2017
Time-Domain Modeling of Grounding Systems’ Impulse Response Incorporating Nonlinear and Frequency-Dependent Aspects O Kherif, S Chiheb, M Teguar, A Mekhaldi, N Harid IEEE Transactions on Electromagnetic Compatibility 60 (4), 907-916	50	2017
Kron-Branin Modeling of YY-Tree Interconnects for the PCB Signal Integrity Analysis416 B Ravelo, O Maurice IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY 59 (2), 411-419	50	2017

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